JETWAY NF835A Series Manual de usuario
NF835A Series
User’s Manual
NO.: G03-NF835A-F
Revision: 1.0
Release date: January 21, 2021
Trademark:
* Specifications and Information contained in this documentation are furnished for information use only, and are
subject to change at any time without notice, and should not be construed as a commitment by manufacturer.
ii
Environmental Protection Announcement
Do not dispose this electronic device into the trash while discarding. To minimize
pollution and ensure environment protection of mother earth, please recycle.
iii
ENVIRONMENTAL SAFETY INSTRUCTION................................................................................... iv
USER’S NOTICE.................................................................................................................................... v
MANUAL REVISION INFORMATION................................................................................................ v
ITEM CHECKLIST..................................................................................................................................v
CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD
1-1 FEATURE OF MOTHERBOARD.........................................................................................1
1-2 SPECIFICATION.................................................................................................................... 2
1-3 LAYOUT DIAGRAM...............................................................................................................3
CHAPTER 2 HARDWARE INSTALLATION
2-1 JUMPER SETTING................................................................................................................ 8
2-2 CONNECTORS AND HEADERS........................................................................................ 12
2-2-1 CONNECTORS........................................................................................................12
2-2-2 HEADERS................................................................................................................ 16
CHAPTER 3 INTRODUCING BIOS
3-1 ENTERING SETUP................................................................................................................ 24
3-2 BIOS MENU SCREEN........................................................................................................... 25
3-3 FUNCTION KEYS...................................................................................................................25
3-4 GETTING HELP......................................................................................................................26
3-5 MEMU BARS...........................................................................................................................26
3-6 MAIN MENU............................................................................................................................ 27
3-7 ADVANCED MENU................................................................................................................28
3-8 CHIPSET MENU..................................................................................................................... 41
3-9 SECURITY MENU.................................................................................................................. 44
3-10 BOOT MENU........................................................................................................................... 47
3-11 SAVE & EXIT MENU..............................................................................................................48
TABLE OF CONTENT
iv
Environmental Safety Instruction
Avoid the dusty, humidity and temperature extremes. Do not place the product in
any area where it may become wet.
0 to 60 centigrade is the suitable temperature. (The figure comes from the request
of the main chipset)
Generally speaking, dramatic changes in temperature may lead to contact
malfunction and crackles due to constant thermal expansion and contraction from
the welding spots’ that connect components and PCB. Computer should go
through an adaptive phase before it boots when it is moved from a cold
environment to a warmer one to avoid condensation phenomenon. These water
drops attached on PCB or the surface of the components can bring about
phenomena as minor as computer instability resulted from corrosion and oxidation
from components and PCB or as major as short circuit that can burn the
components. Suggest starting the computer until the temperature goes up.
The increasing temperature of the capacitor may decrease the life of computer.
Using the close case may decrease the life of other device because the higher
temperature in the inner of the case.
Attention to the heat sink when you over-clocking. The higher temperature may
decrease the life of the device and burned the capacitor.
v
USER’S NOTICE
COPYRIGHT OF THIS MANUAL BELONGS TO THE MANUFACTURER. NO PART OF THIS MANUAL,
INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED
OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN
PERMISSION OF THE MANUFACTURER.
THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE
DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME
WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY
KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTIAL OR CONSEQUENTIAL
DAMAGES (INCLUDING DAMANGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,
INTERRUPTION OF BUSINESS AND THE LIKE).
PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE
REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE
USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT
INTENT TO INFRINGE.
Manual Revision Information
Reversion Revision History Date
1.0 First Edition January 21, 2021
Item Checklist
Motherboard
Cable(s)
1
Chapter 1
Introduction of the Motherboard
1-1 Feature of Motherboard
Onboard Intel®Whiskey Lake-U series processor, TDP 15 W, never denies high
performance
Support 2* DDR4 2400MHz SO-DIMM, maximum capacity up to 32GB
Onboard 2 * RJ-45 gigabit Ethernet LAN port
Support 1 * DP,1* HDMI, 1*EDP, 1*LVDS (*EDP and LVDS are selectable)
Support 3 independent displays
Onboard 1 * M.2 M-key slot, type-2242/2260/2280,PCIe x4(NVMe) and SATA
interface are selectable
Onboard 1 *M.2 E-key slot,type-2230,support Wi-Fi / Bluetooth with Intel CNVi
interface
Support 1 * SATAIII device
Support 4* USB 3.1 Gen.2 + 2* USB 3.1 Gen.2 (Type-C & Vertical type) + 3* USB
2.0
Support 6* COM (*COM1 supports RS232/422/485)
Support CPU Smart FAN
Compliance with ErP standard
Support Watchdog function
Solution for Digital Signage / Industrial PCs / Factory Automation / IoT Solution
2
1-2 Specification
Spec
Description
Design
3.5”SBC; 8-Layers; PCB size: 14.8x 10.2 cm
Embedded
CPU
Integrated with Intel®Whiskey Lake-U series CPU (TDP 15W)
*Note: CPU model varies from different IPC options. Please consult your
dealer for more information of onboard CPU.
Memory Slot
2*DDR4 SO-DIMM slot support 2* DDR4 2400MHz non-ECC
SO-DIMM up to 32GB
Support dual channel function
*Note: Memory clock supporting range is decided by specific CPU of the
model. For more memory compatibility information please consults your
local dealer.
Expansion
Slot
1* M.2 M-key slot, type-2242/2260/2280, PCIe x4(NVMe) and SATA
interface are selectable (M2M)
M.2 E-key slot,type-2230, support Wi-Fi / Bluetooth with Intel CNVi
interface (M2E)
Storage
1* SATAIII 6Gb/s port
LAN Chip
Integrated with 1*Intel i211AT & 1*Intel i219LM Gigabit LAN chip
Support Fast Ethernet LAN function of providing 10/100/1000Mbps
Ethernet data transfer rate
BIOS
AMI Flash ROM
Rear I/O
1* 9~24V DC-in power Jack
1* display port (DP)
1* HDMI port
4* USB 3.1 (Gen.2) port
1* USB 3.1 (Gen.2) Type-C port
2* RJ-45 LAN port
1* Audio Line Out port(No Function)
Internal I/O
1* 2-pin internal 9~24V DC-in power connector
1* Internal vertical USB 3.1 (Gen.2) port connector
1* SATA Power-out connector
1* CPU FAN header
3
1* Front panel header
1* 9-pin USB 2.0 header (Expansible to 2* USB 2.0 ports)
1* 4-pin USB 2.0 header (Expansible to 1* USB 2.0 port)
6* Serial port header (COM1~COM6;COM1 supports RS232/422/485)
1* Front panel audio header(No Function)
1* 3W amplifier header(No Function)
1* GPIO header
1* EDP header (selection with LVDS)
1* LVDS header(selection with eDP)
1* LVDS inverter header
1* I2C_CON header
1*PS/2 keyboard & mouse header
1* LAN LED activity LED header+1* Wi-Fi/BT activity LED header
1-3 Layout Diagram
Rear IO Diagram:
Warning!!
The board has a 9~24V DC-in power connector (DC_IN) in I/O back panel and an internal
9~24V power connector (DC2P). User can only connect one type of compatible power supply
to one of them to power the system.
RJ-45
LAN Ports
USB 3.1 (Gen.2)
Ports
*Line-Out Port
(No Function)
USB 3.1 (Gen.2)
Type-C Port
Display Port
(DP)
HDMI Port
9~24V DC-in
Power Jack
4
Diagram-Front Side:
*Note:Line-Out port, front panel audio header and speaker header are functionless for lack of
audio codec.
M.2 E-key Slot
(M2E)
M.2 M-key Slot
(M2M)
EDP Header
LVDS Header
2*DDR4
SODIMM Slots
Serial Port Headers
(COM1~6)
LAN_LED Header
WLAN_LED Header
*Front Panel
Audio Header
(No Function)
GPIO Port
Header
SATAIII Port
SATA Power-out
Connector
Front Panel
Header
(JW_FP1)
USB 2.0 Header
USB 2.0 Header
Vertical
USB 3.1 (Gen.2)
Connector
I2C_CON
Header
PS/2
Keyboard &Mouse
Header
CPUFAN
Connector
Internal 9~24V DC-In
Power Connector
Display Port
over HDMI Port
USB 3.1 (Gen.2)
Ports
RJ-45
LAN Ports
USB 3.1 (Gen.2)
Type-C Port
*Line-out Port
(No Function)
*Speaker Header
(No Function)
INVERTER
9~24V DC-In
Power Jack
5
Jumper Positions:
JP1
AT_COPEN
JP3
JP4
JP2
JBAT
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