Intel H61 Express Manual de usuario

TECHNICAL MANUAL

Intel H61 Express Chipset

Based Mini-ITX M/B

NO. G03-NF9F-F

Revision: 2.0

Release date: October 1, 2019

Trademark:

* Specifications and Information contained in this documentation are furnished for information use only, and are

subject to change at any time without notice, and should not be construed as a commitment by manufacturer.

Environmental Protection Announcement

Do not dispose this electronic device into the trash while discarding. To minimize

pollution and ensure environment protection of mother earth, please recycle.

ENVIRONMENTAL SAFETY INSTRUCTION...........................................................................iii

USER’S NOTICE .......................................................................................................................iv

MANUAL REVISION INFORMATION.......................................................................................iv

ITEM CHECKLIST.....................................................................................................................iv

CHAPTER 1 INTRODUCTION OF THE MOTHERBOARD

1-1 FEATURE OF MOTHERBOARD................................................................................1

1-2 SPECIFICATION.........................................................................................................2

1-3 LAYOUT DIAGRAM....................................................................................................3

CHAPTER 2 HARDWARE INSTALLATION

2-1 JUMPER SETTING .....................................................................................................8

2-2 CONNECTORS AND HEADERS................................................................................10

2-2-1 CONNECTORS .............................................................................................10

2-2-2 HEADERS .....................................................................................................12

CHAPTER 3 INTRODUCING BIOS

3-1 ENTERING SETUP .....................................................................................................20

3-2 BIOS MENU SCREEN ................................................................................................21

3-3 FUNCTION KEYS .......................................................................................................21

3-4 GETTING HELP ..........................................................................................................22

3-5 MAIN BAR...................................................................................................................22

3-6 MAIN MENU................................................................................................................23

3-7 ADVANCED MENU.....................................................................................................24

3-8 CHIPSET MENU..........................................................................................................33

3-9 BOOT MENU...............................................................................................................36

3-10 SECURITY MENU.......................................................................................................37

3-11 SAVE & EXIT MENU...................................................................................................38

TABLE OF CONTENT

iii

Environmental Safety Instruction

Avoid the dusty, humidity and temperature extremes. Do not place the product in

any area where it may become wet.

0 to 60 centigrade is the suitable temperature. (The figure comes from the request

of the main chipset)

Generally speaking, dramatic changes in temperature may lead to contact

malfunction and crackles due to constant thermal expansion and contraction from

the welding spots’ that connect components and PCB. Computer should go

through an adaptive phase before it boots when it is moved from a cold

environment to a warmer one to avoid condensation phenomenon. These water

drops attached on PCB or the surface of the components can bring about

phenomena as minor as computer instability resulted from corrosion and oxidation

from components and PCB or as major as short circuit that can burn the

components. Suggest starting the computer until the temperature goes up.

The increasing temperature of the capacitor may decrease the life of computer.

Using the close case may decrease the life of other device because the higher

temperature in the inner of the case.

Attention to the heat sink when you over-clocking. The higher temperature may

decrease the life of the device and burned the capacitor.

USER’S NOTICE

INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT MAY BE REPRODUCED, TRANSMITTED

OR TRANSLATED INTO ANY LANGUAGE IN ANY FORM OR BY ANY MEANS WITHOUT WRITTEN

PERMISSION OF THE MANUFACTURER.

THIS MANUAL CONTAINS ALL INFORMATION REQUIRED TO USE THIS MOTHER-BOARD SERIES AND WE

DO ASSURE THIS MANUAL MEETS USER’S REQUIREMENT BUT WILL CHANGE, CORRECT ANY TIME

WITHOUT NOTICE. MANUFACTURER PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY

KIND, AND WILL NOT BE LIABLE FOR ANY INDIRECT, SPECIAL, INCIDENTAL OR CONSEQUENTIAL

DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFIT, LOSS OF BUSINESS, LOSS OF USE OF DATA,

INTERRUPTION OF BUSINESS AND THE LIKE).

PRODUCTS AND CORPORATE NAMES APPEARING IN THIS MANUAL MAY OR MAY NOT BE

REGISTERED TRADEMARKS OR COPYRIGHTS OF THEIR RESPECTIVE COMPANIES, AND THEY ARE

USED ONLY FOR IDENTIFICATION OR EXPLANATION AND TO THE OWNER’S BENEFIT, WITHOUT

INTENT TO INFRINGE.

Manual Revision Information

Reversion Revision History Date

2.0 Second Edition October 1, 2019

Item Checklist

Motherboard

Cable(s)

I/O Back panel shield

Chapter 1

Introduction of the Motherboard

1-1 Feature of Motherboard

Intel®H61 express chipset

Support LGA 1155 CPU socket Intel®Core™ i7 processors / Intel®Core™ i5

processors / Intel®Core™ i3 processors

Support DDRIII 1066-1333 SO-DIMM up to 16GB and dual channel function

Integrated with Realtek RTL8111EVL Gigabit Ethernet LAN chip

Integrated with RealTek ALC662-GR 6-channel HD Audio Codec

Support USB 2.0 data transport demands.

Support PCIE 2.0 x16 by 16 Lane slot and Mini PCI-E slot

Support TPM 1.2 function

Support CPU Smart FAN

Supports ACPI S3 Function

Compliance with ErP Standard

Support Watchdog Timer Technology

1-2 Specification

Spec

Description

Design



Mini-ITX form factor 6 layers ; PCB size: 17.0x17.0cm

Chipset



Intel H61 Express Chipset

CPU Socket



Support Intel®Core™ i7 Processor, Intel®Core™ i5

Processor, Intel®Core™ i3 Processor

in the LGA 1155

Socket

* for detailed CPU support information please visit our website

Memory Slot



DDRIII SO-DIMM slot x 2

Support DDRIII 1066/1333 MHz SO-DIMM ex

pandable to

16GB



Support dual channel function

Expansion Slot 

PCIE 2.0 x16 by 16 lane slot x1



Mini-PCIE slot x1

Gigabit LAN Chip



Integrated with Realtek RTL8111EVL PCI-E Gigabit LAN

chips



Support Fast Ethernet LAN function of providing

10/100/1000 Mbps Ethernet data transfer rate

Audio Chip 

Realtek ALC662-GR 6-channel Audio Codec integrated



Audio driver and utility included

BIOS



32M DIP Flash ROM

Multi I/O



COM port connector x 4

DVI-D port connector x1

VGA port connector x1

RJ-45 LAN connector x1

USB 2.0 port connector x 3

Audio connector x1 (Line-in, Line-out, MIC)

SATAII Connector x4



Front panel audio header x1



Parallel port header x1

PS/2 keyboard & mouse header x1

GPIO header x1

TPM 1.2 header x1

Serial port header x2

RS422/RS485 header x1

9-pin USB 2.0 header x2

CIR header x1

Speaker header x1

PWRLED header x1

Front panel header x1

HDMI_SPDIF header x1

1-3 Layout Diagram

Rear IO Diagram

MIC-IN

VGA Port

Line-IN

Line-OUT

RJ-45 LAN Port

USB Ports

Serial Ports

DVI-D Port

USB Port

Motherboard Internal Diagram

USB Headers

ATX Power Connector

ATX 12V Power Connector

Speaker Header

Audio Connector

Intel LGA1155

CPU Socket

HDMI_SPDIF

Header

GPIO Header

Intel H61 Chipset

PCI Express 2.0 x16 by 16 Lane slot

CPUFAN Header

SATAII Ports

PWRLED

Header

Front Panel

Audio Header

Front Panel

Header

SYSFAN1 Header

CIR Header

TX-RX COM6

Header

Serial Ports

DVI-D Port

over VGA Port

RJ-45 Port over

USB Ports

USB Port

Parallel Port

Header

TPM Header

Serial Port Headers

SYSFAN2Header

PS/2 KB &MS

Header

SODIMM1

Slot

SODIMM2

Slot

Mini-PCIE Slot

Motherboard Jumper Position

JBAT

JP5

CASE OPEN

JP3

JP4

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