Intel H310 Manual de usuario

TECHNICALMANUAL

Intel H310/H370Express Chipset

Based Mini-ITXM/B

NO. G03-NF893-F

Revision:1.0

Release date:January 4, 2019

Trademark:

*SpecificationsandInformationcontainedinthisdocumentationarefurnishedforinformationuseonly,andare

subjecttochangeatanytimewithoutnotice,andshouldnotbeconstruedas acommitmentbymanufacturer.

EnvironmentalProtection Announcement

Donotdisposethiselectronicdeviceintothe trashwhilediscarding.Tominimize

pollution andensureenvironment protection of motherearth, pleaserecycle.

ENVIRONMENTAL SAFETYINSTRUCTION...................................................................iii

USER SNOTICE.............................................................................................................iv

MANUAL REVISIONINFORMATION..............................................................................iv

ITEMCHECKLIST...........................................................................................................iv

CHAPTER1INTRODUCTIONOF THEMOTHERBOARD

1-1FEATUREOFMOTHERBOARD.............................................................................1

1-2SPECIFICATION.....................................................................................................2

1-3LAYOUTDIAGRAM................................................................................................3

CHAPTER2HARDWAREINSTALLATION

2-1JUMPERSETTING.................................................................................................9

2-2CONNECTORS,HEADERSAND WAFERS...........................................................13

2-2-1CONNECTORS.........................................................................................13

2-2-2HEADERS&WAFERS..............................................................................20

CHAPTER3INTRODUCINGBIOS

3-1ENTERING SETUP.................................................................................................25

3-2BIOSMENU SCREEN............................................................................................26

3-3FUNCTIONKEYS...................................................................................................26

3-4GETTING HELP......................................................................................................27

3-5MENU BARS..........................................................................................................27

3-6MAINMENU ...........................................................................................................28

3-7ADVANCEDMENU.................................................................................................29

3-8CHIPSET MENU.....................................................................................................40

3-9SECURITYMENU...................................................................................................43

3-10 BOOT MENU..........................................................................................................46

3-11 SAVE &EXIT MENU...............................................................................................47

TABLEOFCONTENT

iii

EnvironmentalSafetyInstruction

lAvoidthe dusty,humidityand temperatureextremes.Donotplacetheproductin

anyareawhereit maybecomewet.

l0to40 centigrade isthe suitabletemperature.(The temperaturecomesfromthe

requestof the chassisandthermalsolution)

lGenerallyspeaking,dramaticchangesintemperaturemayleadtocontact

malfunction andcracklesdue toconstant thermalexpansion andcontractionfrom

the weldingspots thatconnectcomponentsand PCB.Computershouldgo

throughan adaptivephasebeforeitbootswhen itismoved fromacold

environmenttoawarmerone toavoidcondensation phenomenon.Thesewater

dropsattached on PCBorthesurfaceofthe componentscan bring about

phenomena asminorascomputerinstabilityresulted fromcorrosion and oxidation

fromcomponentsand PCBorasmajorasshortcircuitthatcan burnthe

components. Suggest startingthe computeruntilthe temperaturegoesup.

lThe increasing temperatureofthe capacitormaydecreasethe lifeofcomputer.

Using the closecasemaydecreasethe lifeofotherdevicebecausethe higher

temperatureinthe innerof the case.

lAttentiontothe heatsinkwhen you over-clocking.The highertemperaturemay

decreasethe lifeof the deviceandburned the capacitor.

USER SNOTICE

COPYRIGHTOFTHISMANUALBELONGSTOTHEMANUFACTURER.NOPARTOFTHISMANUAL,

INCLUDINGTHEPRODUCTSAND SOFTWAREDESCRIBEDINITMAYBEREPRODUCED,TRANSMITTED

ORTRANSLATEDINTOANYLANGUAGEINANYFORMORBYANYMEANSWITHOUTWRITTEN

PERMISSIONOFTHEMANUFACTURER.

THISMANUALCONTAINSALLINFORMATIONREQUIREDTOUSETHISMOTHER-BOARDSERIES ANDWE

DOASSURETHISMANUALMEETSUSER SREQUIREMENTBUTWILLCHANGE,CORRECTANYTIME

WITHOUTNOTICE.MANUFACTURERPROVIDES THISMANUAL “ASIS”WITHOUTWARRANTYOFANY

KIND,ANDWILL NOTBELIABLEFORANYINDIRECT,SPECIAL,INCIDENTALORCONSEQUENTIAL

DAMAGES(INCLUDING DAMAGES FORLOSS OFPROFIT, LOSS OFBUSINESS,LOSSOFUSE OFDATA,

INTERRUPTIONOFBUSINESSAND THELIKE).

PRODUCTSAND CORPORATENAMESAPPEARINGINTHISMANUALMAYORMAYNOTBE

REGISTEREDTRADEMARKSORCOPYRIGHTSOFTHEIRRESPECTIVECOMPANIES,AND THEYARE

USEDONLYFORIDENTIFICATIONOREXPLANATIONAND TOTHEOWNER SBENEFIT,WITHOUT

INTENTTOINFRINGE.

Manual Revision Information

Reversion RevisionHistoryDate

1.0First Edition January4, 2019

ItemChecklist

RMotherboard

RDVDformotherboardutilities

RUser sManual

RCable

(s)

Chapter1

Introduction of theMotherboard

1-1 FeatureofMotherboard

lIntel®H310/H370 express chipset

lLGA1151 CPUsocketsupportsIntel®Coffee Lake-Sseriesprocessor(TDP ≤65

W).

lSupport 2*DDR42400MHzSO-DIMM up to32GBand dualchannelfunction

lSupport 1*Inteli219-VGigabit Ethernet LANchip

lSupport USB 3.1datatransportdemand

lSupport 2*SATAIII (6Gb/s)ports

lSupport1*PCIEx1slot, 1*M.2E-key2230 PCIeslotand1*M.2M-key

2242/2260/2280slot

lSupport 1*HDMI +1*DP+1*LVDS(option witheDP)

lSupport 1*COM, optional4/6*USB 3.1&4*USB 2.0forrichIO expansion

lSupport Smart FANfunction

lSupportsACPI S3Function

lCompliancewithErPStandard

lSupportWatchdog TimerTechnology

1-2 Specification

Spec

Description

Design lThinmini-ITXformfactor;PCBsize: 17.0x17.0cm

Chipset lIntel H310/H370 Express Chipset

CPUSocket lIntel

LGA1151 Socket forCoffee Lake-Sseriesprocessors

*Note: fordetailed CPUsupport information pleasevisitourwebsite

MemorySlot

DDR

DIMMslot

lSupport DDR4 2400/2666 MHzSO-DIMMup to32GB

lSupport dualchannel function

ExpansionSlot

1* PCIEx1

slot (

)

l1* M.2PCIEslot(M2E,2230 E-keyPCIEinterface)

Storage

*SATAIII 6G/sport

(SATA

)

l1* M.2M-keyslot,type-2242/2260/2280 withSATAinterface(

M2M

*SATA/PCIEinterface)

*Note: PCIE signal issupported byNF893-H370 seriesonly.

LANChip lIntegrated with1* Intel i219-V GigabitPCI-ELANchip

lSupport Fast Ethernet LANfunction ofproviding 10/100/1000Mbps

Ethernet datatransferrate

AudioChip lRealtekALC662-VD4-channel AudioCodecintegrated

lAudiodriverand utilityincluded

BIOS lAMIFlashROM

Multi I/O

Rear Panel I/O:

l1*19VDC-inPowerJack

l4* USB 3.1(Gen.1)port (Optional for NF893-H310 Series)

l4* USB 3.1(Gen.2)port (Optional for NF893-H370 Series)

l1* HDMI port

l1* DPport

l1* RJ-45 LANport

l1* Line-out port

l1* MICport

Internal I/OConnectors&Headers:

l1*2-pin19Vinternal powerconnector

l1* CPUFANconnector&1* SYSFANconnector

l1* SATAPower-out connector

l1* MON_SWconnector

1* Front panel header

l1* PS/2keyboard&mouseheader

l1* Serialportheader

l1* GPIO header

l2* 9-PinUSB2.0headerfor4* USB2.0ports

l1* 19-PinUSB3.1(Gen.2)headerfor2* USB3.1(Gen.2)ports(Optional

for NF893-H370 Series)

l1*Front panelaudioheader

l1* DMIC_CONdigital microphone header

l1* Speakerheader

l1* PN_LEDheader(forLANactivityLED/BluetoothactivityLED/

WIFI

activityLED)

l1* LVDSconnector(Default)or1* EDPconnector(Optionalbyorder)

l1*Inverterheader

1-3 LayoutDiagram

RearIODiagram

*Note: NF893-H310 seriescomewith 4* USB3.1(Gen.1) portswhichsupports5Gpsdatatransfer

rate; NF893-H370 seriescomewith 4* USB3.1(Gen.2) portswhichsupports10Gpsdatatransferrate

MIC Port

Line-OutPort

RJ-45 LANPort

Display Port

HDMIPort

USB3.

Ports

19VDC

Power Jack

MotherboardInternalDiagram-Front

NF893-H310 Series:

LGA 1151

CPUSocket

H310Chipset

DDR

SODIMMSlots

(SODIMM1/2)

LANPort

Line

Out

Port

MIC

Port

HDMI

Port

Display

Port

USB3.1

(Gen.1)Ports

19VDC

PowerJack

Internal 19VDC

PowerConnector

SATAIIIPorts

(SATA1/2)

SYSFAN

Connector

CPUFAN

Connector

FrontPanel

Header

Inverter

USB2.0Port

Header

USB2.0Port

Header

GPIOHeade

M.2M-Key Slot

(M2M)

PS2KBMSHeader

M.2E-Key Slot

(

M2E

)

FrontPanel

Audio

Header

CIEX1Slot

(PCI

SPEAK_CON

Header

DMIC_CON

Header

PN_LED

Header

SATAPower

Connector

(SATAPWR)

LVDS

Connector

(Optionalwith

EDP)

MON_SW

Header

SerialPort

Header

NF893-H370 Series:

*Note: The productdiagrams areforillustration purposeonlyand mostlycomefrom Model

NF893-H370, unless otherwisenoted.

LGA 1151

CPUSocket

H370Chipset

DDR

SODIMMSlots

(SODIMM1/2)

LANPort

Line

Out

Port

MIC

Port

HDMI

Port

Display

Port

USB3.1

(Gen.2)Ports

19VDC

PowerJack

Internal 19VDC

PowerConnector

SATAIIIPorts

(SATA1/2)

SYSFAN

Connector

CPUFAN

Connector

FrontPanel

Header

USB2.0Port

Header

USB2.0Port

Header

GPIOHeader

SerialPort

Header

M.2M-Key Slot

(M2M)

PS2KBMSHeader

M.2PCIESlot

(

M2E

)

FrontPanel

Audio

Header

PCIEX1Slot

(PCI

MON_SW

Header

SPEAK_CON

Header

DMIC_CON

Header

PN_LED

Header

SATAPower

Connector

(SATAPWR)

*USB3.1(Gen.2)

Header

Inverter

LVDS

Connector

(Optionalwith

EDP)

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