Hyundai R329DP Series Instrucciones de montaje

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple model if applicable]

LCD Monitor / R329DP*

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic

instructions for the disassembly of HKC IT products to remove components and materials requiring selective treatment,

as defined by EU directive 2012/19/EU, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatement

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quality

of items

included

in product

Printed Circuit Board (PCB) or Printed Circuit

Assemblies (PCA) With a surface greater than 10 sq 5

Batteris All types including standard alkaline and lithium

coin or button style batteries None -

Mercury-containing components For example, mercury in lamps, display backlights.

Scanner lamps, swithches, batteries -

Liquid Crystal Display (LCD) with a surface

greater than 100 sq cm

Included background illuminated displays with gas

discharge lamps 1

Cathode Ray Tubes (CRT) None

Capacitors / Condensers (Containing PCB/PCT) None

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height Electrolytic Capacitors 1

External electrical cables and cords DP cable, HDMI cable 2

Gas Discharge Lamps None -

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or

PCAs already listed as a separate item above)

None -

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and

toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations. None -

Components and wates containing asbestos None -

Components, parts and materials containing

refactory ceramic fibers None -

Components, parts and material containing

radioactive substances None -

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where

components and materials requiring selective treatment can be removed.

Tool Description

Tool Size

(if

applicable)

Screwdrivers and 1

Plastic Jig 1

Nipper 1

Product Disassembly Process

List the basic steps that should typically be followed to remove components and materials requiring selective

tratement:

1. With the aid of a screwdriver, loosen the four screws of stand.

2. Loosen the two screws of rear cover with screwdriver and then disassemble the rear cover from set.

3. Disconnect the backlight wire from the panel.

4. Loosen the three screws of driver board with screwdriver then disassemble driver board from set.

5. Loosen the six screws of mainboard cover with screwdriver then disassemble mainboard cover from set.

6. Loosen the four screws of mainboard with screwdriver then disassemble mainboard from set.

7. Loosen the four screws of speakers with screwdriver then disassemble speakers from set.

8. Disconnect the LVDS cable from the panel.

9. Loosen the five screws of front frame with screwdriver.

10. Loosen the six screws of Middle frame with screwdriver then disassemble middle frame from set.

1. Disassemble and Assemble

2. Disassemble Product

1. Unscrew the 3 points screw on Cover stand assembly using a screwdriver

2. unscrew the 3 points screw under Front cover

3. Remove the cover from the bottom of monitor

by using the jig or “-“driver.

4. disassemble from left side of monitor

bottom

5. disassemble top side of monitor

6. disassemble right side of monitor

7. Place the monitor as shown in the figure, hold the bottom of the rear cover and remove the rear cover.

8. Disconnect the usb extension cable.

9. Unscrew the screws 6 points to remove the front cover.

10. separate tape of 2 points.

11. Separate Boards

11-1 Separate main board.

Unscrew 4 points with screw driver and disconnect cables. ( LVDS/Inverter/Speakers/OSD/Power)

Key board

Main board Power board

Disconnect cables

11-2 Separate Power board.

Unscrew 4points with screw driver and separate the shield cover.

After separate the shield cover, unscrew 4points on the power board.

Electrolytic Capacitors are removed using a Nipper and then separated and processed separately.

11-3 Separate Key board and others.

Unscrew 6points with screw driver and remove each parts.

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