HP ES3-H Series Instrucciones de instalación

MF877-00 Page 1

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Product End-of-Life Disassembly Instructions

Product Category

: Storage

Marketing Name / Model

[List multiple models if applicable.]

HPE Nimble Storage Expansion ES3-HXXXXX

HPE Nimble Storage Expansion AFS3

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPE products to remove components and materials requiring selective treatment, as defined by

Directive 2012/19/EU of the European Parliament and of the Council on Waste Electrical and Electronic Equipment

(WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

2 PSUs, 2 in Each PSU

External electrical cables and cords

2 Power Cables, 2 SAS cables

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

MF877-00 Page 2

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Item Description Notes

Quantity

of items

included

in product

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Philips Screwdriver

P0,P1,P2

Standard Screwdriver

Medium

Diagonal Cutters

Small,

Medium

Adjustable Wrench

4-6”

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove all the HDDs or SSDs from the front. Pop out the drives from the carriers and shred and dispose of properly

per data protection protocols and contract(s) as applicable. Some customers may require certification of this step.

2. Remove Power Supplies from rear of Unit, disassemble by pulling off plastic tab on ejector, removing 20 screws and

removing the PCBAs. Locate the 2 Electrolytic capacitors per the graphic below and cut or pry them off. Dispose of

properly.

3. Remove the mounting ears from each side of the chassis in the front. Disassemble to remove the small PCBA in each

ear and dispose of properly.

4. Slide the Controllers out the rear of the chassis and remove 3 PCBAs from each controller. Dispose of properly.

5. Remove the screws and the top cover to access the large midplane and the Power distribution board.

6. Remove Screws holding the power distribution board. Cut Cables or remove nuts holding cables to power distribution

board. Dispose of properly

7. Remove the screws from the bottom of the chassis to release the Midplane. Dispose of properly.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

MF877-00 Page 3

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

Power Supply

Mounting Ear:

MF877-00 Page 4

Template Revision C, 30-July-2018

HPE instructions for this template are available at MF877-01

ES3 Controller

Power Distribution Board and Midplane

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