HP S14 Instrucciones de instalación

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP S14 14” Portable Display

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

I/F Board*1

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps Panel*1

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

USB3.1 Type-C cable*1

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Use tool to separate rear cover from monitor head.

2. Use tool to release screw*6 on the interface board, then disassemble interface-BD from the chassis by hand.

3. Disassemble the bracket Type C from bezel by hand.

4. Use tool to release screw*2 on the control board, then disassemble control board and FFC Cable from the chassis by

hand.

5. Use tool to release screws*18 on assembly MF, then separate the assembly MF from bezel.

6. Disassemble the eDP cable from connector by hand.

7. Disassemble panel from bezel by hand.

8. Disassemble magnets, power button, control button, rubber power button and rubber control button from bezel by hand.

9. Use tool to release glass on bezel, then separate the glass from bezel.

10.

11.

12.

13.

14.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1. Use tool to separate rear cover from monitor head.

EL-MF877-00 Page 3

Template Revision B

PSG instructions for this template are available at EL-MF877-01

2. Use tool to release screw*6 on the interface board, then disassemble interface-BD from the chassis by hand.

3.Disassemble the bracket Type C from bezel by hand.

EL-MF877-00 Page 4

Template Revision B

PSG instructions for this template are available at EL-MF877-01

4. Use tool to release screw*2 on the control board, then disassemble control board and FFC Cable from the chassis

by hand.

5. Use tool to release screws*18 on assembly MF, then separate the assembly MF from bezel.

6. Disassemble the eDP cable from connector by hand.

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

7. Disassemble panel from bezel by hand.

8. Disassemble magnets, power button, control button, rubber power button and rubber control button from bezel by

hand.

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

9. Use tool to release glass on bezel, then separate the glass from bezel.

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