HP 22er Instrucciones de montaje

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Monitors and Displays

Marketing Name / Model

[List multiple models if applicable.]

HP 22er 21.5-inch Display

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium

coin or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface

greater than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

EL-MF877-00 Page 2

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Description #1 SCREW DRIVER(Plum flower head)

Description #2 screwdriver

PH2

Description #3 Hex nut screwdriver

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Release base stand by pushing a white button then strip screw to separate base and hinge

2. Strip the screws from rear cover so that the rear cover can be removed , then remove deco

3. Remove all material under rear cover contain rear cover supporter

4. Separate main board and shielding

5. Release all materials and put some by ESD

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

24-07-201

HP Restricted

Page 1

Step 1 Quick release Base stand

(1).Pull out base and stand

a. Press white button with one hand

b. Pull out stand & base with another hand

(2).Disassy base and stand

Press the white button

Twist out the screw

24-07-201

HP Restricted

Page 2

Step 2: Strip the screws from rear cover, then move rear cover follow the below way ,at last

remove deco

Step 3: To remove the shielding(contain the other material );

(3.1) Dismantle the rear cover supporter

(3.2) Pull out the LVDS/ LED FFCs to separate the base assembly from the unit;

(3.3) Remove the four screws to separate shielding from CB

Remove the screws with

Screwdriver

Dismantle the rear cover first

from the two marked position

Remove the 8pin FFC from main

board then remove rear cover

24-07-201

HP Restricted

Page 3

Step 4: Strip the screws *7pcs

24-07-201

HP Restricted

Page 4

Step 5: Release all materials and put some by ESD;

Can follow the picture as bellow;

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