HP Z2 SFF G5 Instrucciones de montaje

EL-MF877-00 Page 1

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP Z2 SFF G5 Workstation

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the

disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU directive

2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking code on the

plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.

Item Description Notes

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries, excluding Li-Ion batteries.

All types including standard alkaline, coin or button style

batteries

Li-Ion batteries. Include all Li-Ion batteries if more than

one is provided with the product (such as a detachable

notebook keyboard battery, RTC coin cell, etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[ ] screws

[X] snaps

[ ] adhesive

[ ] other. Explain

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater than

100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring greater

than 2.5 cm in diameter or height

Acbel 260W EPA92 PSU

External electrical cables and cords

Power Cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

EL-MF877-00 Page 2

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Item Description Notes

Quantity of

items

included in

product

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing refractory

ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components and

materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Hexagon Screw Driver

T-15

Crisscross Screw Driver

PH1

Electric Iron

QUICK 310

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment

including the required steps to remove the external enclosure:

1. Open access panel

2. Remove Front Bezel from chassis

3 Press the Graphic card’s latch

4 Unplug Graphic card

5. Loose the screws of HDD and remove HDD from HDD cage

6. Disconnect HDD power cable and HDD SATA cable from HDD

7. Disconnect all cables from MB

8. Remove the driver cage from Chassis

9. Disconnect system fan cable from MB

10. Disconnect cooler fan cable from MB

11. Remove the Fan duct from cooler

12. Use T-15 screwdriver to loose the screws and remove cooler

13. Use PH1 screwdriver to loose the screws and remove the fan

14. Separate the fan from cooler

15. Remove memory from MB

16. Rotate the handle and open it up

17. Remove the CPU from the board

18. Remove the battery from the system board

19. Remove speaker from Chassis

20. Remove WLAN M.2 Card

21. Use T-15 screwdriver remove the screws on the PSU Chassis

22. Disconnect the PSU cable from the MB

23. Use T-15 screwdriver to loose the screws of MB from board

24. Remove MB from chassis

25. Press the PSU’s latch on chassis

26. Remove the PSU from chassis

27. Use PH1 screwdriver to remove screw for the PSU

28. Remove cover

EL-MF877-00 Page 3

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

29. Use PH1 screwdriver to remove FG screw

30. Disconnect fan connector and inlet connector

31. Use PH1 screw driver to remove PCB1 screw

32. Use PH1 screwdriver to remove AC inlet & Fan screw

33. Heat the solder of the Electrolytic Capacitors of greater than 2.5cm in diameter or height and Remove it

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the

product that require selective treatment (with descriptions and arrows identifying locations).

Step1 Open access panel

Step2 Remove front bezel from chassis

Step 3 Press the Graphic card’s latch

Step 4 Unplug Graphic card

Step 5

Loose the screws of HDD and remove HDD from HDD

cage

Step 6

Disconnect HDD power cable and HDD SATA cable

from HDD

EL-MF877-00 Page 4

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step7 Disconnect all cables from MB

Step8Remove the driver cage from Chassis

EL-MF877-00 Page 5

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step 9 Disconnect system fan cable from MB

Step 10 Disconnect cooler fan cable from MB

Step 11 Remove the Fan duct from cooler

Step 12 Use T-15 screwdriver to loose the screws and remove

cooler

EL-MF877-00 Page 6

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step 13 Use PH1 screwdriver to loose the screws and remove

the fan

Step 14 Separate the fan from cooler

Step 15

Remove memory from MB

Step 16

Rotate the handle and open it up

EL-MF877-00 Page 7

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step 17 Remove the CPU from the board

Step 18 Remove the battery from the system board

Step 19 Remove speaker from Chassis

Step 20 Remove WLAN M.2 Card

EL-MF877-00 Page 8

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step 21 Use T-15 screwdriver remove the screws on the PSU

Chassis

Step 22 Disconnect the PSU cable from the MB

Step 23 Use T-15 screwdriver to loose the screws of MB from

board

Step 24 Remove MB from chassis

EL-MF877-00 Page 9

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step 25 Press the PSU’s latch on chassis

Step 26 Remove the PSU from chassis

Step 27

Use PH1 screwdriver to remove screw for the PSU

Step 28

Remove cover

EL-MF877-00 Page 10

Template Revision C

Last revalidation date 09-May-2018

HPI instructions for this template are available at EL-MF877-01

Step 29 Use PH1 screwdriver to remove FG screw

Step 30 Disconnect fan connector and inlet connector

Step 31 Use PH1 screw driver to remove PCB1 screw

Step 32 Use PH1 screwdriver to remove AC inlet & Fan screw

Step 33

Heat the solder of the Electrolytic Capacitors of greater

than 2.5cm in diameter or height and Remove it

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