HP Vectra VEi 7 Manual del producto

Technical Reference Manual

Vectra Technology

This manual is a technical reference document for engineers and

technicians providing system level support. It is assumed that the reader

possesses a detailed understanding of AT-compatible microprocessor

functions and digital addressing techniques.

Technical information that is readily available from other sources, such as

manufacturer’s proprietary publications, has not been reproduced.

This manual contains summary information only. For additional reference

material, refer to the bibliography inside this document.

HP Vectra VEi 7, VEi 8, VLi 8 and

VLi 8 SF PCs

Contents

Francais iii

Core Components and Technologies

Processors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Intel Celeron (Socket 370) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Intel Pentium II . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8

Intel Pentium III. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

GTL+ Technology. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Pentium Processor Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Chip Sets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

The Intel 440ZX AGPset (VEi 8, VLi 8 and VLi 8SF PCs). . . . . . . . . . . . 11

Intel 440ZX PAC Chip. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11

The PIIX4E PCI/ISA Bridge Chip (82371EB). . . . . . . . . . . . . . . . . . . . . .13

The SiS 620/5595 Chip Set (VEi 7 PCs) . . . . . . . . . . . . . . . . . . . . . . . . . . 17

The SiS 620 Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .17

The SiS 5595 PCI/ISA Bridge Chip . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18

Mass-Storage Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Ultra-ATA Hard Disk Drives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

DVD Drives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24

AGP Graphics Controllers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Matrox Millennium G200 AGP Graphics (VEi 8, VLi 8 and VLi 8SF PCs) . . .

SiS Super AGP Graphics (VEi 7 PCs). . . . . . . . . . . . . . . . . . . . . . . . . . . . 29

Crystal Integrated PCI Audio. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30

Network Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

HP 10/100 3Com 3C905B-TX Network Interface Card (D7504A and D7505A)

iv Francais

HP 10/100 Intel PRO/100+ Management Adapter (D7506A and D7507A) . .

LAN Card Ready Program. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

Input Devices . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Standard HP Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Enhanced HP Keyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 35

Scrolling Mouse . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36

Connectors and Sockets . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37

Bibliography

Data sheets can be obtained at:

❒Matrox Millennium G200 AGP (graphics controller)

www.matrox.com/mga/products/millennium_g200/home.htm

❒Intel Chipsets. 440ZX AGPSet (82443ZX) and

PIIX4E PCI/ISA Bridge Chip (82371EB)

www.intel.com/design/chipsets/datashts

❒SiSChipsets.SiS620andSiS5595PCI/ISABridgeChip(includes

information on the integrated super AGP graphics controller)

www.sis.com/tw/products/pentium2/s620.htm

❒Celeron, Pentium II & Pentium III Processors

www.intel.com/design/celeron/datashts

www.intel.com/design/pentiumII/datashts

www.intel.com/design/pentiumIII/datashts

❒PC Data Sheets

www.hp.com/vectra

❒Crystal Audio

www.cirrus.com/products/overviews/cs4280.html

www.cirrus.com/products/overviews/cs4297.html

❒Intel LAN card

www.intel.com/network/products/pro100mgmt.htm

Hewlett-Packard white papers are available on a variety of subjects

including AGP graphics, SDRAM memory and the Ultra ATA/33

protocol at:

❒www.hp.com/desktop/library/wp.html

Core Components and Technologies

This chapter describes core components of the PCs such as processors,

chip sets, mass storage devices, graphics controllers, audio controllers,

network features and input devices.

Core Components and Technologies

Processors

Intel Celeron (Socket 370)

The Socket 370 Intel®Celeron™processor has the following features:

•128K on-die L2 cache

•Intel MMX™technology, which gives higher performance for media,

communications and 3D applications.

Socket 370 is a conversion of Slot 1 (used by the Pentium®II and

Pentium III) to a socket. The Socket 370 Celeron shares the same P6

microarchitecture as the Pentium II. The reduction in size achieved by

the Socket 370 Celeron is due to the integration of the L2 cache on the

processor die.

The heatsink is supplied separately from the processor. The processor

is locked in place in the plastic pin grid array (PPGA) by a lever.

Thermal efficiency is further enhanced by a heat interface gum

supplied with the heatsink.

Intel Pentium II

The Pentium II processor connects to the motherboard via a single

edge 242-contact slot (Slot 1) connector. It comes in eithera SECC or a

SECC 2 package (see “Pentium Processor Packages” below).

The Pentium II processor has several performance-enhancing features:

•Dual Independent Bus architecture, which combines a dedicated 64-

bitL2 cache bus(supportinglevelcache sizes of 512K),plus a64-bit

system bus with non-ECC that enables multiple simultaneous

transactions.

•Intel MMX technology, which improves video

compression/decompression, image manipulation, encryption and

I/O processing.

•Dynamic execution to speed up software performance.

Core Components and Technologies

Processors

Intel Pentium III

The Pentium III processor uses the same basic core and L2 cache as

the Pentium II. In addition to this, however, it uses 70 new multimedia-

oriented instructions known as SSE (streaming SIMD extensions).

These SIMD (single instruction multiple data) instructions enable the

CPU to perform simultaneous floating point calculations on multiple

data. This brings substantial improvements to 3D graphics, video

encoding and decoding and other floating point-intensive operations

that operate on large sets of data such as voice recognition. Like the

Pentium II, the Pentium III processor connects to the motherboard by

a Slot 1 connector. It comes in a SECC 2 package only (see “Pentium

Processor Packages” below).

GTL+ Technology

The Processor-Local (PL) bus of Socket 370 Celeron, Pentium II and

Pentium III processors, also referred to as their FSB (Front Side Bus),

is implemented in GTL+ technology. This technology features open-

drain signal drivers that are pulled-up to 1.5 V through 56 ohm

resistors on the bus, acting as bus terminators.

The supported operating frequencies of the GTL+ bus are 66 or

100 MHz. The width of the data bus is 64 bits, the width of the address

is 32 bits.

The control signals of the PL bus allows the implementation of a “split

-transaction” bus protocol. This allows the processor to send its

request (such as asking for the contents of a given memory address)

and then to release the bus, rather than waiting for the result, thereby

allowing the bus to accept another request. The target device (PCI

AGP controller chip) then requests the bus again when it is ready to

respond, and sends the requested data packet. Up to four transactions

can be outstanding at any given time.

Pentium Processor Packages

The processor and level-2 cache memory are packaged in a self-

contained, pre-sealed module, installed in a Slot 1socket on the system

board.

Core Components and Technologies

Processors

The heat sink is supplied with the processor, and is bolted to it by the

manufacturer. The processor is held in place by a retention mechanism.

Pentium II processors use either a Single Edge Contact Cartridge

(SECC) or a Single Edge Contact Cartridge 2 (SECC 2) packaging

technology. These packages allow the L2 cache to be tightly coupled to

the processor, while enabling the use of high volume commercial SRAM

components. The Pentium III comes in the SECC2 package only.

Pentium Processor Packaging

SECC

(Single Edge Contact

Cartridge)

SECC2

(Single Edge Contact

Cartridge 2)

Heat Sink ATXV2 SECC2 Heat Sink

Weight 237 g 130 g

Dissipation 40 W 36 W

Attach Locations Interfaces with thermal plate Substrate holes

Connector SC242 SC242

Heat SinkClip Riv screws SECC2 H/S clip

SECC 2 package

(exploded view) processor

heatsink clips

heatsink

SECC package

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