HP RP9 G1 9018 Instrucciones de instalación

EL-MF877-00 Page 1

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP RP9 G1 AiO Retail System, Model 9018

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps N/A

Cathode Ray Tubes (CRT)

N/A

Capacitors / condensers (Containing PCB/PCT)

N/A

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

N/A

External electrical cables and cords

N/A

Gas Discharge Lamps

N/A

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

N/A

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations. N/A

Components and waste containing asbestos

N/A

Components, parts and materials containing

refractory ceramic fibers

N/A

EL-MF877-00 Page 2

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PSG instructions for this template are available at EL-MF877-01

Components, parts and materials containing

radioactive substances

N/A

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Hexagonal Screwdriver (T15)

T15 2.55-

3.00kgf.cm

Philips Screwdriver

2# 2.55-

3.00kgf.cm

Knife

Side Cutter

Star key wrench

Slotted Screwdriver

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Disassembly process – Removing Back Cover

2. Disassembly process – Installing Wireless Card

3. Disassembly process –Installing DIMM

4. Disassembly process – Do not remove the HDD cage

5. Disassembly process -Remove the HDD cage

6. Disassembly process (CPU Installing)

7. Disassembly process (Installing back cover bracket)

8. Disassembly process (Assemble MCR, webcam, BIO reader (If necessary)

9. Disassembly process (MSR,Webcam,BIO)

10. Disassembly process (Assemble back cover)

11. Compact Stand Assembling (Without Power Supply)

12.

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

1.Description of the sample submitted for assessment

EL-MF877-00 Page 3

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PSG instructions for this template are available at EL-MF877-01

Product view

Disassembly process (Removing Back Cover)

EL-MF877-00 Page 4

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PSG instructions for this template are available at EL-MF877-01

Push the button on the middle bezel to

each side，see photo 1

Disassemble the back cover by pulling

it upward and cover See photo 2.

Take off the rear cover, see photo 3

Disassemble the

bracket, see photo 4

Disassemble the bracket by the red

circle marked position and take off

the bracket, see photo 5

Lift up the bracket,see photo 6

Pressing the visa cover hook and push

it to the direction show in the photo 7,8

and 9.

Disassembly process (Installing Wireless Card)

EL-MF877-00 Page 5

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Install the wireless card atan angle of

45 degree.See photo 1

Fasten WIFI screw*1pcs as show in

photo 21.5 + /-0.2Kgf.cm Screw

driver: #1(Crosshead

Screwdriver)See photo 2

Using pressing fixture to insert

cable in location“2”.Routing the

cable See photo3&4 Using pressing

fixture to insert cable in location“

1”.Routing the cable See photo3&4

Final cable routing for WLAN (

Photo 4)

Disassembly process (Installing DIMM)

Take the DIMM and insert in DIMM slot

at an angle of 45 degree.See photo 1

Press the DIMM to confirm the DIMM

insert rightly See photo 2

Disassembly process (Do not remove the HDD cage)

EL-MF877-00 Page 6

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Unlocking the 2 screws on the HDD

bracket see photo 1（T15）3.0+/-

0.3kgf.cm

Lift up the HDD bracket horizontally

and take down the HDD bracket, see

photo 2,3

Assemble the second SSD Card to the

SSD2 mark connector, and fix the SSD

card to theunit by lock the screw ,see

photo 4

Assemble the first SSD Card to the

SSD1 mark connector, and fix the

SSD card to the unit by lock the

screw , see photo 3

EL-MF877-00 Page 7

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Assembling the HDD bracket to the unit

and lock the 2pcs screws, see photo 6

（T15）3.0+/-0.3kgf.cm

Disassembly process (Do not remove the HDD cage)

Assemble the first SSD Card to the

SSD1 mark(left position)connector

byone hand, and hold the

Mylar by another hand

see photo 1

Press the SSD to confirm it insert

rightly, and lock the screw to fix the SSD

on the MB, pull the Mylar aside at same

time, see photo 2

EL-MF877-00 Page 8

Template Revision B

PSG instructions for this template are available at EL-MF877-01

HDD Module Processing and

Installing(if necessary)

Do not remove the HDD cage

Remove the tape on the HDD cage See

photo 1

Take 4 screw to lock

the HDD,(#1）1.5+/-0.3kgf.cm

See photo 2

Plug the HDD screw holder to the

hold on HDD cage

See photo 3

Slide the HDD holder

splinter and assemble

the HDD to the HDD

cage rightly

See photo 4

Insert the SATA cable

to the HDD

See photo 5

Check the connector is

inserted rightly

See photo 6

Disassembly process (Remove the HDD cage)

EL-MF877-00 Page 9

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Unscrew the 2 screws and remove

the HDD bracket See photo 1 and

Take 4 screw to lock

the, （#1）1.5+/-

0.3kgf.cm

See photo 3

Install HDD in the unit

See photo4

Check the Mylar connected to the MB

rightly, see photo 6

Insert the HDD SATA cable to HDD

See photo5

Disassembly process (CPU Installing)

EL-MF877-00 Page 10

Template Revision B

PSG instructions for this template are available at EL-MF877-01

Open the CPU cover and take off

the plastic cover, check whether

there is PIN bend issue,See photo

2 for the bend pin

Put the CPU onto the CPU socket

vertical by fixture, see photo 3 and 4

Put the CPU onto the CPU socket

vertical by fixture, see photo 3 and

Locking the CPU holder, and during this

process, the CPU holder clip will drop

from the CPU holder,take clip away from

the MB, see photo 5 and 6

Lock the heat sink to MB, and lock the

3 screws based on the sequence

shown on heat sink,see photo 7and 8

Disassembly process (Installing visa cover)

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