HP ProDesk 405 G1 Instrucciones de instalación

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP ProDesk 405 G1 Microtower Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU

directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).

1.0 Items Requiring Selective Treatment

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description Notes

Quantity

of items

included

in product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm

Batteries

All types including standard alkaline and lithium coin

or button style batteries

Mercury-containing components

For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

External electrical cables and cords

Power cord

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

system fan 94g,PSU fan 68g

162g

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

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Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

Tool Description

Tool Size (if

applicable)

Screw driver

T-15

Micro shear

YN-3

Screw driver

PH1

Description #4

Description #5

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:

1. Remove access panel. (see Figure 1-3)

2. Remove front bezel. (see Figure 4)

3. Disconnect cooler cable then remove the cooler from board. (see Figure5-7)

4. Disconnect 24 pin power cable、SATA cable、SATA power cable、CPU power cable. (see Figure 8-11)

5. Remove the ODD and HDD from chassis (see Figure 12-16)

6. Disconnect the MCR cable from board then remove the MCR. (see Figure 17-19)

7. Disconnect system fan cable then remove the system fan from chassis (see Figure 20-22)

8. Disconnect FIO cables and open the cable clip. (see Figure 23-24)

9. Remove the FIO module from chassis. (see Figure 25-26)

10. Disconnect PWR cable then remove it from chassis. (see Figure 27-28)

11. Disconnect speaker cable then remove it from chassis. (see Figure 29-31)

12. Remove the Memory from chassis. (see Figure 32)

13. Remove the battery from the board. (see Figure 33)

14. Remove Mother board from chassis. (see Figure 34-36)

15. Remove the I/O shielding from chassis. (see Figure 37)

16. Remove the PSU from chassis. (see Figure 38&39)

17. Remove the PSU chassis and remove the PSU board.. (see Figure 40-43)

18. Remove the Electrolytic Capacitors from PSU board. (see Figure 44-54)

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying locations).

Figure1 Loose the two screws from access panel

Figure2 Slide the access panel back

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Figure3 Rotate the top of the panel away to remove it

Figure4 Pull the 3 hooks and rotate to remove the front

bezel

Figure5 Disconnect the cooler cable from MB

Figure6 Loose 4 screws from cooler and remove it

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Figure7 Remove the cooler from board

Figure8 Disconnect the SATA cables form board

Figure9 Disconnect the CPU power cable from board

Figure10 Disconnect the 24pin power cable from MB

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Figure11 Disconnect the SATA and power cables from

ODD

Figure12 Loose the ODD screws

Figure13 Remove the ODD from chassis

Figure14 Disconnect the SATA and power cables from

HDD

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Figure15 Loose the HDD screws

Figure16 Remove the HDD form chassis

Figure17 Disconnect the MCR cable from MB

Figure18 Loose the MCR screws

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Figure19 Remove the MCR from chassis

Figure20 Disconnect system fan cable from board

Figure21 Loose 2 screws from system fan

Figure22 Remove the system fan from chassis

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Figure23 Disconnect FIO cable include USB 3.0 , USB 2.0 ,

Audio

Figure24 Open the cable clip

Figure25 Loose the screw of the FIO cable

Figure26 Remove the FIO cable from chassis

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Figure27 Disconnect PWR cable from MB

Figure28 Remove the PWR cable

Figure29 Disconnect speaker cable from board

Figure30 Loose the screw of speaker

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Figure31 Remove the speaker form chassis

Figure32 Push the hooks on both sides and then pick up the

memory

Figure33 Remove the battery from the MB

Figure34 Loose the 6 screws from MB

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