HP All-in-One Instrucciones de montaje
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP All-in-One PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
MB, Webcam, converter board ,power button board
4
Batteries
All types including standard alkaline and lithium coin
or button style batteries
7
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
1
Cathode Ray Tubes (CRT)
0
Capacitors / condensers (Containing PCB/PCT)
0
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
0
External electrical cables and cords
0
Gas Discharge Lamps
0
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
0
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
0
Components and waste containing asbestos
0
Components, parts and materials containing
refractory ceramic fibers
0
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1
2# X10
Description #2
1# X10
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Please refer to the 3.2.3 disassemble rear cover
2. Please refer to the 3.2.4 disassemble the stand
3. Please refer to the 3.2.5 disassemble Speaker
4. Please refer to the 3.2.6 disassemble HDD & ODD
5. Please refer to the 3.2.7 disassemble MB Shielding
6. Please refer to the 3.2.8 disassemble FAN Module
7. Please refer to the 3.2.9 disassemble converter board
8. Please refer to the 3.2.10 disassemble Webcam
9. Please refer to the 3.2.11 disassemble Wireless card
10. Please refer to the 3.2.12 disassemble the cables connected from MB
11. Please refer to the 3.2.13 disassemble MB and MB battery
12. Please refer to the 3.2.14 disassemble DDR
13. Please refer to the 3.2.15 separate Base pan and front bezel and panel
14. Please refer to the 3.2.16 remove Mouse/Keyboard Battery/MB
15. Please refer to the 3.2.17 remove power supply
16.
17.
18.
19.
20.
21.
22.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
4. Disassemble speaker
Remove 4pcs screws from left and right,
Also remove the speaker cable with in yellow circle in order to take out two speakers from system.
5. Disassemble HDD & ODD
Remove 1pcs screw with circles in red from HDD and pull backward to disengage the HDD from base pan.
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
8, Disassemble converter board
Remove two cables and 2pcs screws to remove the converter board.
9, Disassemble Webcam
Remove the cable and screw in order to disengage the webcam module and mechanical parts.
10, Disassemble Wireless card
Remove one or two cables and 1pcs screw in order to remove wireless card.
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
11, Disassemble the cables connected to MB and Base pan.
(1), Remove the HDD /ODD cable
Remove the cable with circles in yellow and remove 4pcs screws with circles in red.
(2) Remove LVDS cable connected from MB.
(3), Remove antenna cable on the Base pan and take away the cable.
EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
12. Disassemble MB and MB battery
Remove 5pcs screws to disassemble the INTEL(Daisy) MB
Pull backward the clip with in yellow circle to release the battery
13, Disassemble DDR
(1), Pull both clicks outward that holding the memory to remove the DDR.
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
14, Separate Base pan and front bezel and panel
(1)Remove 14pcs screws with circles in red to separate base pan and front bezel.
(2), Remove 4pcs screws with circles in red to separate base pan and AUO/LG/CM0049 Panel
15, Remove Mouse/Keyboard Battery/MB
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
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