HP 286 Pro G3 Instrucciones de instalación
EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions
Product Category: Personal Computers
Marketing Name / Model
[List multiple models if applicable.]
HP 286 Pro G3 Microtower Business PC
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions
for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU
directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment.
1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as
applicable.
Item Description
Notes
Quantity
of items
included
in product
Printed Circuit Boards (PCB) or Printed Circuit
Assemblies (PCA)
With a surface greater than 10 sq cm
PCA, PSU
2
Batteries
All types including standard alkaline and lithium coin
or button style batteries PCA
1
Mercury-containing components
For example, mercury in lamps, display backlights,
scanner lamps, switches, batteries
Liquid Crystal Displays (LCD) with a surface greater
than 100 sq cm
Includes background illuminated displays with gas
discharge lamps
Cathode Ray Tubes (CRT)
Capacitors / condensers (Containing PCB/PCT)
Electrolytic Capacitors / Condensers measuring
greater than 2.5 cm in diameter or height
PSU
1
External electrical cables and cords
AC Power Cable
1
Gas Discharge Lamps
Plastics containing Brominated Flame Retardants
weighing > 25 grams (not including PCBs or PCAs
already listed as a separate item above)
System Fan
1
Components and parts containing toner and ink,
including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent
chambers, and service stations.
Components and waste containing asbestos
Components, parts and materials containing
refractory ceramic fibers
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components, parts and materials containing
radioactive substances
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components
and materials requiring selective treatment can be removed.
Tool Description
Tool Size (if
applicable)
Description #1 Crisscross Screw Driver
PH1
Description #2 Hexagon Screw Driver
T-15
Description #3 Electric Iron
QUICK 310
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. Remove access panel (Step1)
2. Disconnect ODD/ HDD power cable and ODD/ HDD SATA cable from ODD (Step2~Step3)
3. Remove ODD/ HDD from chassis (Step4~Step7)
4. Remove all cables and heat sink from MB (Step8~Step11)
5. Remove the Memory/ CPU/ Battery from MB (Step12~Step14)
6. Remove front panel from chassis (Step15)
7. Remove MB from chassis (Step16)
8. Remove system fan (Step17)
9. PSU from chassis (Step17~Step19)
10. Separate PSU and remove the Electrolytic Capacitors (Step 20~Step23)
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items
contained in the product that require selective treatment (with descriptions and arrows identifying locations).
Step1 Loose thumb screw and remove
access panel.
EL-MF877-00 Page 3
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step2 Disconnect ODD power cable and
ODD SATA cable from ODD.
Step3 Disconnect HDD power cable and
HDD SATA cable from HDD.
Step4 Remove the driver cage from
chassis
EL-MF877-00 Page 4
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step5 Press the ODD’s latch on ODD cage
Step6 Remove the ODD from ODD cage
Step7 Use T-15 screwdriver to loose the
screws of HDD and remove HDD from HDD
cage
EL-MF877-00 Page 5
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step8 Disconnect all cables from MB.
Step9 Disconnect heat sink fan cable from
MB
Step10 Use T-15 screwdriver to loose the
screws and remove heat sink
EL-MF877-00 Page 6
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step11 Use PH1 screwdriver to loose the
screws and remove the heat sink fan.
Step12 Remove the Memory from MB
Step13 Rotate the handle and open it up to
remove CPU from MB.
EL-MF877-00 Page 7
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step14 Remove the battery from MB.
Step15 Remove front panel from chassis
Step16 Use T-15 screwdriver to loose the
screws of MB and remove MB from
chassis
EL-MF877-00 Page 8
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step17 Use PH1 screwdriver to loose the
screws of system fan and remove it
Step18 Use T-15 screwdriver to loose the
screws of PSU
Step19 Press the PSU’s latch on chassis
and remove it.
EL-MF877-00 Page 9
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step20 Use PH1 screwdriver to loose
screws from PSU
Step21 Open the PSU cage and use PH1
screwdriver to loose the screw of PCBA
cable
Step22 Use PH1 screwdriver to loose
screws and remove PCB from case
EL-MF877-00 Page 10
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Step23 Use Electric Iron remove caps from
PCB
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