HP 280 G5 SFF Business PC Instrucciones de montaje

EL-MF877-00

Template Revision C

Page 1

Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

1.0 Items Requiring Selective Treatment

Product End-of-Life Disassembly Instructions

Product Category: Personal Computers

Marketing Name / Model

[List multiple models if applicable.]

HP 280 G5 SFF Business PC

Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions

for the disassembly of HPI products to remove components and materials requiring selective treatment, as defined by EU

directive 2012/19/EC, Waste Electrical and Electronic Equipment (WEEE).

NOTE: Recyclers should sort plastic materials into resin streams for recycling based on the ISO 11469 plastic marking

code on the plastic part. For any questions on plastic marking, please contact HP’s Sustainability Contact.

1.1 Items listed below are classified as requiring selective treatment.

1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as

applicable.

Item Description

Notes

Quantity of

items

included in

product

Printed Circuit Boards (PCB) or Printed Circuit

Assemblies (PCA)

With a surface greater than 10 sq cm 2

Batteries, excluding Li-Ion batteries. All types including standard alkaline, coin or button

style batteries

Li-Ion batteries. Include all Li-Ion batteries if more

than one is provided with the product (such as a

detachable notebook keyboard battery, RTC coin

cell, etc.)

Battery(ies) are attached to the product by (check all

that apply with an “x” inside the “[ ]”):

[ ] screws

[x] snaps

[ ] adhesive

[ ] other. Explain

EL-MF877-00

Template Revision C

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Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

Item Description

Notes

Quantity of

items

included in

product

NOTE: Add detailed removal procedures including

required tools in the sections 3.1 and 3.2.

Mercury-containing components For example, mercury in lamps, display backlights,

scanner lamps, switches, batteries

Liquid Crystal Displays (LCD) with a surface greater

than 100 sq cm

Includes background illuminated displays with gas

discharge lamps

Cathode Ray Tubes (CRT)

Capacitors / condensers (Containing PCB/PCT)

Electrolytic Capacitors / Condensers measuring

greater than 2.5 cm in diameter or height

PSU 1

External electrical cables and cords DC Cable for External Power Supply 1

Gas Discharge Lamps

Plastics containing Brominated Flame Retardants

weighing > 25 grams (not including PCBs or PCAs

already listed as a separate item above)

Components and parts containing toner and ink,

including liquids, semi-liquids (gel/paste) and toner

Include the cartridges, print heads, tubes, vent

chambers, and service stations.

Components and waste containing asbestos

Components, parts and materials containing

refractory ceramic fibers

Components, parts and materials containing

radioactive substances

2.0 Tools Required

List the type and size of the tools that would typically be used to disassemble the product to a point where components

and materials requiring selective treatment can be removed.

EL-MF877-00

Template Revision C

Page 3

Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

Tool Description Tool Size (if

applicable)

Hexagon Screw Driver

T-15

Electric Iron QUICK 310

Crisscross Screw Driver PH1

3.0 Product Disassembly Process

3.1 List the basic steps that should typically be followed to remove components and materials requiring selectivetreatment

including the required steps to remove the external enclosure:

1. Remove access panel (Step1-2)

2. Disconnect ODD/ HDD cable and remove ODD/ HDD (Step3~Step11)

3. Remove all cables and cooler from MB(step12-16)

4. Remove Memory/CPU/GFX/WLAN/Batteryfrom MB(step17~23)

5. Remove antenna from chassis (step24

6. Remove MB from chassis(Step25~26)

7. Remove PSU from chassis(step27~29)

8. Separate PSU and remove the Electrolytic Capacitors（step30~33）

3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items

contained in the product that require selective treatment (with descriptions and arrows identifying location

L-MF877-00

emplate Revision C

ast revalidation date 08

-May-2020

HPI instructio

mplate are available at EL-MF877-01

ge 4

Step1 Use T-15 screwdriver to Loose thumb

screw and remove access panel.

Step2 Remove front bezel from chassis

Step3 Loose screw and remove blank module

Step4 Disconnect HDD power cable and HDD SATA cable

from 1st HDD.

Step5 Disconnect ODD power cable and ODD SATA

cable from ODD.

ns for this t

Step6 Press the ODD’s latch on ODD cage and remove ODD

EL-MF877-00

Template Revision C

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Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

Step7 Use T-15 screwdriver to Loose screw

Step8 Remove the driver cage from Chassis

Step9:Use T-15 screw driver to loose the screws of HDD

and remove HDD from HDD cage

Step10 Disconnect HDD power cable and HDD SATA cable

from 2ndHDD.

Step11 Loose 2nd HDD screw and remove the 2nd HDD Step12：Disconnect CPU Cooler Fan cable from MB

EL-MF877-00

Template Revision C

Page 6

Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

Step13 Loose the screws and remove cooler fan

Step14: Disconnect system fan cable from MB

EL-MF877-00

Template Revision C

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Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

Step15 Loose the screws and remove system fan

Step16

Disconnect all cables from MB

Step17 Remove memory from the MB

Step18 Rotate the handle and open it up

EL-MF877-00

Template Revision C

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Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

Step19:Remove the CPU from the board

Step20 loose screw from behind panel

Step21 remove graphic card from board Step22 Remove the battery from MB

Step23 Remove M.2 WLAN card Step24 Loose the screw of rear antenna and remove it

EL-MF877-00

Template Revision C

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Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

Step25 Loose the all screws of motherboard

Step26 Remove motherboard from chassis

EL-MF877-00

Template Revision C

Page 10

Last revalidation date 08-May-2020

HPI instructions for this template are available at EL-MF877-01

Step27 Remove the screws of PSU from chassis

Step28 Press the PSU’s latch on chassis

Step29 Remove the power supply from chassis

Step30 loose screws from top and right

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