Heltec Automation HTE029A1 Manual

TECHNICAL

SPECIFICATION

Model Number : HTE029A1

Description: Screen Size: 2.9"

Color: Black and White

Display Resolution: 296*128

Chengdu Heltec Automation technology CO., LTD.

HTE029A1

www.heltec.cn

2／30

Version

Content

Date

Producer

1.0

New release

2015/01/10

2.0

Modify Reference Circuit

2017/03/02

3.0

Updating

2017/06/22

3.1

Modify Reference Circuit

2017/08/04

3.2

Modify Mechanical Drawing

2017/08/11

HTE029A1

www.heltec.cn

3／30

CONTENTS

GeneralDescription.......................................................................................................... 4

Features...................................................................................................................................4

Application..............................................................................................................................4

MechanicalSpecification..................................................................................................4

Mechanical Drawing ofEPD module..............................................................................5

Input/OutputTerminals..........................................................................................................6

6.1

PinoutList...........................................................................................................6

6.2

MCUInterface......................................................................................................8

6.2.1

MCUSerial Peripheral Interface (4-wireSPI). ...........................8

6.2.2

MCUSerial Peripheral Interface (3-wire SPI). ...........................9

6.3

External TemperatureSensoroperation.........................................................10

CommandTable.........................................................................................................................11

ReferenceCircuit.................................................................................................................16

MAXIMUMRATINGS........................................................................................................ 18

DC CHARACTERISTICS............................................................................................ 18

Serial PeripheralInterfaceTiming........................................................................................19

PowerConsumption...........................................................................................................19

TypicalOperatingSequence.............................................................................................20

13.1

NormalOperationFlow........................................................................................20

13.2

ReferenceProgramCode.............................................................................21

Opticalcharacteristics.................................................................................................................22

14.1

Specifications......................................................................................................22

14.2

Definition ofcontrastratio..............................................................................23

14.3

ReflectionRatio...............................................................................................23

Handling, Safety, andEnvironment Requirements...............................................24

Reliabilitytest................................................................................................................ 26

BlockDiagram..................................................................................................................27

PartA/PartBspecification...................................................................................................27

Point andlinestandard.........................................................................................................28

Packing....................................................................................................................30

HTE029A1

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General Description

GDE029A1 is an Active Matrix Electrophoretic Display(AMEPD) , with interface and a reference system

design. The 2.9'' active area contains 128×296 pixels, and has 1 -bit B/W full display capabilities. An integrated

circuit contains gate buffer, source buffer, interface, timing control logic, oscillator, DC-DC. SRAM.

LUT ,VCOM,and border are supplied with each panel.

Features

128×296 pixels display

White reflectance above 35%

Contrast ratio 10:1

Ultra wide viewing angle

Ultra low power consumption

Pure reflective mode

Bi-stable display

Commercial temperature range

Landscape, portrait modes

Hard-coat antiglare displaysurface

Ultra Low current deep sleepmode

On chip displayRAM

Waveform stored in On-chipOTP

Serial peripheral interface available

On-chip oscillator

On-chip booster and regulator control for generating VCOM, Gate and Source drivingvoltage

I2C signal master interface to read external temperature sensor

Application

Electronic Shelf Label System

Mechanical Specifications

Parameter

Specifications

Unit

Remark

Screen Size

2.9

Inch

Display Resolution

128(H)×296(V)

Pixel

dpi:112

Active Area

29.1×66.85

Pixel Pitch

0.226×0.227

Pixel Configuration

Rectangle

Outline Dimension

36.7(H)×79.0 (V) ×1.05(D)

Weight

6.5 ±0.2

ConfirmedDrawing

Signature:

Date:

: DESCRIPTION

DATE

NAME

X Z P

TFT OD36.70±0.1

TFT AA 29.10±0.1 3.80

SIDE VIEW BOTTOM VIEW

NOTES：

14.19 12.34

11.53

1 24

0.15±0.03

0.50±0.03

11.50±0.05

12.50±0.2

Total 1.05±0.1

Rubbe r sealing side

RTV

0.10±0.03

FPC+PIS tiffener

T ot al ?Thickness 0.30MM±0.03

?Bending Positon ，

make it f ilex able

Printing white mark line

PI Stiffener T=0.2MM

SIGNAL

GDR

RESE

VGL

VGH

TSCL

TSDA

BS1

BUSY

RES#

D/C#

CS#

VDDIO

VCI

VSS

VDD

VPP

VSH

PREVGH

VSL

PREVGL

VCOM

1. DISPALY MODE 2.9" ARREY FOR EPD;

2. DRIVE IC: IL3820;

3. RESOLUTION:128gate X 296source;

4.pixel pitch:0.226mm X 0.227mm;

5.Unspecified Tolerance:±0.20;

6.Material conform to the ROHS standard

CHK:

APP:

P/N PROJECTION

HTE029A1

Mechanical Drawing of EPD module

TFT OD 79.00±0.1

TFT AA 66.85±0.1

3.00

3.50±0.1

15.32

14.10

6.00

3.20

www.heltec.cn

5／30

Change PAD and FPC shape

14.09.12

Change PAD and FPC,EPLshape and IC

15.1.6

Change PAD and FPC,EPL shape and IC position

15.1.10

ALL UNITS: mm

DATE

MODEL NUMBER :

GDE029A1

CUSTOMER NO.:

HTE029A1

www.heltec.cn

6／30

Input/OutputTerminals

6.1

Pin outList

Pin #

Single

Description

Remark

No connection and do not connect with other NC pins

Keep Open

GDR

N-Channel MOSFET Gate Drive Control

RESE

Current Sense Input for the Control Loop

VGL

Negative Gate driving voltage

VGH

Positive Gate driving voltage

TSCL

I2C Interface to digital temperature sensor Clock pin

TSDA

I2C Interface to digital temperature sensor Date pin

BS1

Bus selection pin

Note 6-5

BUSY

Busy state output pin

Note 6-4

RES #

Reset

Note 6-3

D/C #

Data /Command control pin

Note 6-2

CS #

Chip Select input pin

Note 6-1

serial clock pin (SPI)

serial data pin (SPI)

VDDIO

Power for interface logic pins

VCI

Power Supply pin for the chip

VSS

Ground

VDD

Core logic power pin

VPP

Power Supply for OTP Programming

VSH

Positive Source driving voltage

PREVGH

Power Supply pin for VGH and VSH

VSL

Negative Source driving voltage

PREVGL

Power Supply pin for VCOM, VGL and VSL

VCOM

VCOM driving voltage

HTE029A1

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7／30

Note 6-1: This pin (CS#) is the chip select input connecting to the MCU. The chip is enabled for MCU

communication:only when CS# is pulled LOW.

Note 6-2: This pin (D/C#) is Data/Command control pin connecting to the MCU. When the pin is pulled HIGH,the

data will be interpreted as data. When the pin is pulled LOW, the data will be interpreted as command.

Note 6-3: This pin (RES#) is resetsignal input. The Reset is active low.

Note 6-4: This pin (BUSY) is Busy state output pin. When Busy is high the operation of chip should not be

interrupted and any commands should not be issued to the module. The driver IC will put Busy pin high when the

driver IC is working such as:

-Outputting display waveform; or

-Communicating with digital temperature sensor

Note 6-5: This pin (BS1) is for 3-line SPI or 4-line SPI selection. When it is “Low”, 4-line SPI is selected.

When it is “High”, 3-line SPI (9 bits SPI) is selected. Please refer to below Table.

Table: Bus interface selection

BS1

MPU Interface

4-lines serial peripheral interface (SPI)

3-lines serial peripheral interface (SPI) - 9 bits SPI

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8／30

HTE029A1

6.2

MCU Interface

6.2.1

MCU Serial Peripheral Interface (4-wireSPI)

The 4-wire SPI consists of SCLK (serial clock), SDIN (serial data), D/C# and CS#. D0 acts as SCLK and D1 acts as

SDIN.

Table -1 : Control pins of 4-wire Serial Peripheral interface

Function

CS# pin

D/C# pin

SCLK pin

Write command

↑

Write data

↑

Note: ↑ stands for rising edge of signal

SDIN is shifted into an 8-bit shift register in the order of D7, D6, ... D0. The data byte in the shift register is written to

the Graphic Display Data RAM (RAM) or command register in the same clock. Under serial mode, only write

operations are allowed.

Figure 6-1 : Write procedure in 4-wire Serial Peripheral Interface mode

CS#

D/C#

SDIN/

SCLK

SCLK(D0)

SDIN(D1)

DB1

DB2

DBn

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HTE029A1

6.2.2

MCU Serial Peripheral Interface (3-wire SPI)

The 3-wire serial interface consists of SCLK (serial clock), SDIN (serial data) and CS#. In SPI mode, D0 acts as

SCLK and D1 acts as SDIN. The operation is similar to 4-wire serial interface while D/C# pin is not used. There are

altogether 9-bits will be shifted into the shift register in sequence: D/C# bit, D7 to D0 bit. The D/C# bit (first bit of the

sequential data) will determine the following data byte in the shift register is written to the Display Data RAM (D/C#

bit = 1) or the command register (D/C# bit = 0). Under serial mode, only write operations areallowed.

Table -2 : Control pins of 3-wire Serial Peripheral interface

Function

CS# pin

D/C# pin

SCLK pin

Write command

Tie LOW

↑

Write data

Tie LOW

↑

Note: ↑ stands for rising edge of signal

Figure 6-1 : Write procedure in 3-wire Serial Peripheral Interface mode

D/C#

SDIN(D1)

SCLK

DBn

DB2

DB1

CS#

SDIN/

SCLK

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10／30

HTE029A1

6.3

External Temperature Sensoroperation

There are two ways to let the module get the ambient temperature,

use the external temperature sensor interface, The module provides two I/O lines [TSDA and TSCL] for

connecting digital temperature sensor for temperature reading sensing. TSDA will be treated as SDA line and

TSCL will be treated as SCL line. They are required connecting with the external pull-up resistors when they

are used to connect to the temperature sensor,then the module will check the temperatureautomatically.

use any kinds of external temperature sensor to get the temperature value then converted to hex format,then use the

spi interface send command 0x1A and the temperature value into the module.The temperature value how to

converted to hex as thefollow:

1. When the Temperature value MSByte bit D11 = 0, the temperature is positive and value (DegC) = +

(Temperature value)/16

2. When the Temperature value MSByte bit D11 = 1, the temperature is negative and value (DegC) = ~ (2’s

complement of Temperature value)/16

12-bit binary

(2's complement)

Hexadecimal

Value

Decimal

Value

[DegC]

0111 1111 0000

7F0

2032

127

0111 1110 1110

7EE

2030

126.875

0111 1110 0010

7E2

2018

126.125

0111 1101 0000

7D0

2000

125

0001 1001 0000

190

400

0000 0000 0010

002

0.125

0000 0000 0000

000

1111 1111 1110

FFE

-2

-0.125

1110 0111 0000

E70

-400

-25

1100 1001 0010

C92

-878

-54.875

1100 1001 0000

C90

-880

-55

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