
PageS
KEY
HEATH
OTY.
DESCRIPTION
No.
Part
No.
Hardware (cont'd.)
#8
Hardware
Cl
250-98 6 8-32 x1/2" screw
C2 252-4 6 8-32 nut
C3 252-706 4 8-32 lock nut
C4 253-45 4
#8
flat washer
C5 254-2 6
#8
lockwasher
Other Hardware
Dl
250-1256 2 10-32 x 1/4" screw
D2
254-3 2 #
10
lockwasher
D3 259-26 4
#10
solder lug
D4
252-193 2 Push-on nut
D5 259-22 Spade lug
06
253-8 Brass flat washer
SHEET METAL PARTS
El
200-1296-1 Chassis
E2
203-1891-1 Top cover
E3
203-1892-1 1 Front panel
E4
204-2265 2 Circuit board mounting
bracket
E5 204-2267-1 Cable clamp
E6
204-2292 Tie bracket
E7 206-1249 AC shield
E8
206-1250 Capacitor shield
E9
207-98 Capacitor mounting strap
E10 207-622 Circuit board support clamp
WIRE
344-7 1'6" Large black wire
344-33
2'
Medium black wire
344-111 6'3" Orange wire
344-118 1'3" Large red wire
344-120 2'6" Small black wire
344-121 4' White wire
347-55 7'fJ' 8-wire cable
89-54 Line cord
0
y..
% %
(INCHES)
2
1'(8 I
3:8
I
5{B
I
7;8
I , I I I I I, I
I ! i I i !
"if
i
I"
i)
i I i
0 5 1
(eM)
2 3 4 5 6
CIRCUIT
Compo
No.
3
KEY
HEATH
OTY.
DESCRIPTION
CIRCUIT
No.
Part
No.
Compo
No.
PRINTED
MATERIIAL
Fl
390-1357 Model label
390-1415 Instruction card
F2 390-926 Warning label
F3 391-34 Blue and white label
F4 391-611 Nameplate
F5 390-1371 Keyboard label set
597-260 Parts Order Form
597-1656 Heath User's Group
(HUG) Application
597-1659 HUG return envelope
Assembly Manual (See
Page 1 for part number.)
Operation Manual (See
Page 1 for part number.)
Software Manual (See
Page 1 for part number.)
MISCELLANEOW,
G1
354-7 2 Large cable tie
G2 73-3 1 Rubber grommet
G3 261-20 4 Rubber foot
G4 352-31 Thermal compound*
G5 423-11 Fuseholder
G6 434-148 1 AC socket
G7 432-946 20 25-pin plug
G8 75-736 1 Strain relief
G9 432-120 2 PCB connector
Gl0
73-39
18"
Foam tape
G111
490-5 Nut starter
Gl'!
490-111 IC lifter
Gl~1
490-185 Package of Soder Wick*-
203-1879 Set of side panels
containing:
G14
203-1877 Right side
panel
G1ti 203-1878 Left side
panel
G1E>
446-683 Window
GH
354-5 Small cable tie
85-1936-1 Mother circuit board
701-29 3-ring binder
703-12 Set of 5 tabs (for
binder)
880-1 System software
cassette tape (Assember,
Editor, Basic, Debug)
Solder
*Dow
Corning
thermal
heat
sink
compound
contains
Zinc
Oxides,
Si0
2,
and
slight
traces
of
CO
2,
**I~egistered
Trademark,
Solder
Removal
Company
4 5 6 7
iii
I ! I i
I I i I i I i Ii I
i i I
I ! i I I I i i I
I i i I i I I II i ! I I I
I
8 9
10
11
12
13
14
15
16
17