Haier TDVCF2016 Manual de usuario

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F6B

COLOUR TELEVISION

SERVICEMANUAL

Features

51CMpureflatpicturetube

CCD function

181 programpresetting andmemory

Parental control

InnerDVD

InnerVCR

AVstereoandMTS

Models

TDVCF2016

TV-8888-69

ColorTelevisionModel：20S62(TDVCF2016)

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CONTENTS

1ProductCodeilluminationandSeries Introduction --------------------2

2Features --------------------------------------------------------------------------------3

3Specifications-------------------------------------------------------------------------4

4SafetyPrecautions-------------------------------------------------------------------5

5WarningandCautions--------------------------------------------------------------6

6Netdimension------------------------------------------------------------------------12

7Partsand Functions----------------------------------------------------------------13

8RemoteControllerFunctions----------------------------------------------------14

9Maintenance Service --------------------------------------------------------------16

10CircuitDiagram-----------------------------------------------------------------------22

11CircuitExplanation------------------------------------------------------------------23

12Adjustment-----------------------------------------------------------------------------28

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1. ProductCodeilluminationandSeries Introduction

20 S62

CRTsize(unit:inch)

VCR/DVD/TVcombine

Modelseriesofaspectnumber

Features

Color Television Model

：

20S62(TDVCF2016)

MODEL:20S62

MODEL:20

S62

ITEM

FUNCTION

ITEM

FUNCTION

ain IC LA76834 24

Digital curtain

RT Pure flat 25

Slow fading on & off

olor system NTSC 26

Semitransparent menu

√

udio system M 27

o-flashing channel changing

.of channels 181 28

ZOOM

D language English/French/Sp

anish

16:9 mode

PICTURE

ulti-picture modes 1 30

Games

V stereo

√

Calendar

uper woofer

Child-lock

urrounding sound

Multi-functional lock

reble/bass boost

√

o-picture listening

eft/right balancer

√

Background light

ICAM

Auto-timer on

√

ulti-audio modes

CCD

√

one adjuster

SOFTWA

V-CHIP

√

TS/SAP

√

. of built-in speakers 2

AUDIO

put p

(

)

2*1.5W

back 1,front 1 41

Total power input

（

）

100W

√

Voltage range

（

）

120V

Power frequency

（

）

60HZ

tim

(

)

120

eadphone socket front 45

et weight(KG) 25

JACK

SCART socket

Gross weight(KG) 27.5

Inner

inner

fun

tion

√

et dimension(MM) 570*480*51

inner

fun

tion

√

Packaged dimension(MM) 640*550*56

HiFi

√

Inner

SP/EP

√

Quantity for 40' container

PARA

TER

Quantity for 40' high container

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ColorTelevisionModel：20S62(TDVCF2016)

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3. Specifications

lPOWERSUPPLY:AC120V, 60 Hz

lTuning system: FStuner

lIF:45.75MHz

lPowerconsumption: 100W

lAntenna inputimpedance: 75Ω

lReceivingsystem:

a)Colorsystem: NTSC

b)BroadcastTVsystem:M

lLanguagedisplayed: English/French/Spanish

lVideo input: 1.0VP-P (75Ω)

lAudioinput: 436mVrms(40KΩ)

lVCR system: NTSC, HiFi, SP/EP;

lDVDdistrict mode: 1;

Specifications

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4.SafetyPrecautions

IMPORTANTSAFETYNOTICE

Manyelectricalidentifythesepartsandmechanicalpartsinthischassishavespecial

safety-related characteristics! Inthe SchematicDiagramand Replacement PartsList.

It isessentialthatthesespecialsafetypartsshouldbe replacedwiththesamecomponents

asrecommended inthismanualtoprevent X-RADIATION, Shock, Fire, orotherHazards.

Donot modifythe originaldesign without permission of themanufacturer.

General Guidance

AnIsolation Transformershouldalways be used during theservicing ofareceiverwhose

chassisisnotisolatedfromthe ACpowerline.Useatransformerofadequatepowerrating

asthisprotectsthe technician fromaccidentsthatmightresultinpersonalinjurycaused by

electricalshocks.

It willalsoprotectthe receiverand itscomponentsfrombeing damaged byaccidentalshorts

of the circuitrythat might be inadvertentlyintroduced during theserviceoperation.

If anyfuse(orFusibleResistor)inthisTVreceiverisblown, replaceit withaspecified one.

Whenreplacingahighwattage resistor(Oxide MetalFilmResistor,over1W),keep the

resistor10mm awayfromPCB.

Keep wiresawayfromhigh voltageorhigh temperatureparts.

Due tothe highvacuumand large surfacearea ofthe picturetube,extremecareshouldbe

taken inhandling the PictureTube. Donotlift the PictureTube byitsNeck.

X-RAYRadiation

Warning:

The sourceofX-RAYRADIATIONinthisTVreceiveristhe HighVoltage Sectionandthe

PictureTube.

Forcontinued X-RAYRADIATIONprotection,the replacementtube mustbe ofthe same

type asspecifiedintheReplacement PartsList.

Beforereturningthe receivertothecustomer,

Always performan ACleakage currentcheckon theexposedmetallicpartsofthe cabinet,

suchasantennas,terminals,etc.,tomakesurethatthesetissafetooperatewithoutany

dangerof electricalshock.

SafetyPrecautions

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5. Warning andCautions

1.WhenyoucleantheTVset,pleasepull

outthepowerplugfromACoutlet. Don't

cleanthecabinetandthescreenwith

benzene,petrolandotherchemicals.

4.TopreventtheTVsetfromfiringand

electricshock,don't

maketheTVsetrain

ormoisture.

Inordertoprolongtheusinglifeofthe

TVset, pleaseplaceitonaventilated

place.

5.Don'topenthebackcover,otherwiseitis

possibletodamagethe componentsinthe

TVsetandharmyou.

Don'tplacethe

TVsetinthe

sunshineornear

heatsource.

6.WhentheTVsetisn'tgoing tobeused

forlongtimeoritisinthunderand

lightening,pleasepullouttheplugfromAC

outletandtheantennaplugfromthecover

oftheTVset.

Explanationonthe displaytube

Generally,it isnotneededtocleanthetubesurface.However, ifnecessary,itssurfacecanbe

cleanedwithadrycotton clothaftercuttingoffthepower.Don'tuseanycleanser.Ifusinghard

cloth,thetubesurfacewill be damaged.

CAUTION: Beforeservicingreceiverscoveredbythisservicemanualanditssupplements

and addenda,read and followthe SAFETYPRECAUTIONS.

NOTE: If unforeseen circumstancescreateconflictbetween the following servicing

precautionsandanyofthe safetyprecautions,always followthe safetyprecautions.

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Remember:SafetyFirst.

General ServicingPrecautions

1.Always unplug the receiverACpowercordfromthe ACpowersourcebefore:

a.Removingorreinstallinganycomponent, circuitboardmoduleoranyotherassembly

of the receiver.

b.Disconnecting orreconnecting anyreceiverelectricalplugorotherelectrical

connection.

c.Connecting atest substituteinparallelwithanelectrolyticcapacitorinthe receiver.

CAUTION: Awrong substitutionpartorincorrectinstallation polarityofelectrolytic

capacitorsmayresultinan explosion hazard.

d.Discharging the picturetubeanode.

2.Testhighvoltage onlybymeasuringitwithan appropriatehighvoltage meterorother

voltage-measuringdevice(DVM,FETVOM,etc.)equippedwithasuitablehighvoltage

probe. Donot test high voltage by “drawinganarc”.

3.Discharge the picturetube anode onlyby(a)firstconnecting one end ofan insulated clip

leadtothe degaussingorkine aquadaggrounding systemshieldatthe pointwherethe

picturetube socketgroundlead isconnected,and then (b)touchthe otherendofthe

insulated clipleadtothepicturetube anodebutton,usinganinsulatinghandletoavoid

personalcontact withhigh voltage.

4.Donot spraychemicalson ornearthisreceiveroranyofitsassemblies.

5.Unless specified otherwiseinthisservicemanual,clean electricalcontactsonlyby

applying the following mixturetothe contactswithapipecleaner,cotton-tipped stick or

comparablenonabrasiveapplicator;10%(byvolume)Acetone and 90%(byvolume)

isopropylalcohol(90%-99%strength)

CAUTION: Thisisaflammablemixture.

Unless specified otherwiseinthisservicemanual,lubrication of contactsisnotrequired.

6.Donotdefeatanyplug/socketB+voltage interlocks withwhichreceiverscovered by

thisservicemanualmight beequipped.

7.DonotapplyACpowertothisinstrumentand/oranyofitselectricalassembliesunless

allsolid-statedeviceheatsinks arecorrectlyinstalled.

8.Always connectthe testreceivergroundlead tothereceiverchassisground before

connecting the testreceiverpositivelead.

Always removethe test receiverground leadlast.

9.Usewiththisreceiveronlythe test fixturesspecified inthisservicemanual.

CAUTION: Donot connect the test fixtureground straptoanyheat sinkinthisreceiver.

ElectrostaticallySensitive(ES)Devices

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Somesemiconductor(solidstate)devicescanbe damaged easilybystaticelectricity.Such

componentsareusuallycalledElectrostaticallySensitive(ES)Devices.Examplesoftypical

ES devicesareintegratedcircuitsand somefieldeffecttransistorsand semiconductor “chip”

components.The followingtechniquesshouldbeused tohelpreducethe incidenceof

component damage caused bystaticelectricity.

1.Immediatelybeforehandling anysemiconductorcomponent orsemiconductor-equipped

assembly,drainoffanyelectrostaticchargeon yourbodybytouching aknownearth

ground.Alternatively,obtainandwearacommerciallyavailabledischargingwriststrap

device,whichshouldberemoved topreventpotentialshock priortoapplyingpowertothe

unitundertest.

2.Afterremoving an electricalassemblyequipped withES devices,placethe assemblyon

aconductivesurfacesuchasaluminumfoil,topreventelectrostaticchargebuildupor

exposureof theassembly.

3.Useonlyagrounded-tipsolderingiron tosolderorunsolderES devices.

4.Useonlyan anti-statictype folderremovaldevice.Somesolderremovaldevicesnot

classifiedas “anti-static”can generateelectricalchargessufficient todamage ES devices.

5.Donotusefreon-propelledchemicals.Thesecangenerateelectricalchargessufficient

todamage ES devices.

6.DonotremoveareplacementESdevicefromitsprotectivepackage until immediately

beforeyouarereadytoinstall it.(MostreplacementES devicesarepackaged withleads

electricallyshortedtogetherbyconductivefoam,aluminumfoilorcomparableconductive

material).

7.Immediatelybeforeremoving the protectivematerialfromthe leadsof areplacementES

device,touchthe protectivematerialtothe chassisorcircuitassemblyintowhichthe

devicewillbe installed.

CAUTION: Besurenopowerisappliedtothe chassisorcircuit,andobserveallother

safetyprecautions.

8.Minimizebodilymotionswhen handlingunpackaged replacementES devices.

(Otherwiseevensomenormallyharmless motionssuchasmutualbrushingofyour

clothes fabricorlifting ofyourfootfromacarpeted floormightgeneratestaticelectricity

sufficient todamage an ES device.)

General SolderingGuidelines

1.Useagrounded-tip,low-wattage solderingiron and appropriatetipsizeandshapethat

willmaintaintiptemperaturewithinthe rangeof 500oFto600oF.

2.Usean appropriategauge ofRMAresin-coresoldercomposed of60 partstin/40 parts

lead.

3.Keep the soldering iron tipclean andwelltinned.

4.Thoroughlyclean the surfacestobesoldered. Useamall wirebristle(0.5inch, or1.25cm)

brushwithametalhandle. Donot usefreon-propelled spay-on cleaners.

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5.Usethe following unsoldering technique

a.Allowthe solderingiron tiptoreachnormaltemperature. (500o Fto600o F)

b.Heating the component lead untilthe soldermelts.

c.Quicklydrawthe melted solderwithan anti-static,suction-type solderremovaldevice

withsolderbraid.

CAUTION: Workquicklytoavoidoverheating the circuit boardprintedfoil.

6.Usethe following unsoldering technique

a.Allowthe solderingiron tiptoreachnormaltemperature. (500o Fto600o F)

b.First, holdthe soldering irontipand solderthestrand against the componentlead until

the soldermelts.

c.Quicklymovethe soldering iron tiptothejunction ofthe componentleadandthe

printed circuitfoil,and holditthereonlyuntil the solderflowsontoand around both

the component lead andthe foil.

CAUTION: Workquicklytoavoidoverheating the circuit boardprintedfoil.

d.Closelyinspectthesolderareaandremoveanyexcess orsplashedsolderwitha

small wire-bristlebrush.

Remove/Replacement

Somechassiscircuitboardshaveslotted holes(oblong)through whichthe ICleadsare

inserted and then bentflatagainstthecircuitfoil.When holesareofslotted type,the

followingtechnique shouldbe used toremoveand replacethe IC.When working withboards

usingthe familiarroundhole, usethe standardtechniqueasoutlined.

Removal

Desolderand straighteneachICleadinone operationbygentlyprying up onthelead with

the soldering irontipasthe soldermelts.

Drawawaythe melted solderwithananti-staticsuction-typesolderremovaldevice(orwith

solderbraid)beforeremoving the IC.

Replacement

Carefullyinsert the replacement ICinthe circuitboard.

Carefullybend eachIClead against thecircuitfoilpadand solderit.

Cleanthesolderedareaswithasmallwire-bristlebrush.(It isnotnecessarytoreapply

acryliccoating tothe areas).

Small-Signal”DiscreteTransistor

Removal/Replacement

Removethe defectivetransistorbyclipping itsleadsascloseaspossibletothe component

body.

Bend intoa “U”shape the end ofeachof threeleadsremainingon thecircuit board.

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