Fusion FusionServer XH321L Manual de usuario

FusionServer XH321L V5 Liquid-Cooled Server

Node

Technical White Paper

Issue 07

Date 2023-11-30

xFusion Digital Technologies Co., Ltd.

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Notice

In this document, "xFusion" is used to refer to "xFusion Digital Technologies Co., Ltd." for concise description

and easy understanding, which does not mean that "xFusion" may have any other meaning. Any "xFusion"

mentioned or described hereof may not be understood as any meaning other than "xFusion Digital

Technologies Co., Ltd.", and xFusion Digital Technologies Co., Ltd. shall not bear any liability resulting from

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information, and recommendations in this document are provided "AS IS" without warranties, guarantees or

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xFusion Digital Technologies Co., Ltd.

Address: 9th Floor, Building 1, Zensun Boya Square, Longzihu Wisdom Island

Zhengdong New District 450046

Zhengzhou, Henan Province

People's Republic of China

Website: https://www.xfusion.com

About This Document

Purpose

This document describes the FusionServer XH321L V5 liquid-cooled server node in

terms of features, structure, specifications, and component hardware and software

compatibility.

Intended Audience

This document is intended for pre-sales engineers.

Symbol Conventions

The symbols that may be found in this document are defined as follows.

Symbol Description

Indicates a hazard with a high level of risk which, if not

avoided, will result in death or serious injury.

Indicates a hazard with a medium level of risk which, if

not avoided, could result in death or serious injury.

Indicates a hazard with a low level of risk which, if not

avoided, could result in minor or moderate injury.

Indicates a potentially hazardous situation which, if not

avoided, could result in equipment damage, data loss,

performance deterioration, or unanticipated results.

NOTICE is used to address practices not related to

personal injury.

Supplements the important information in the main text.

NOTE is used to address information not related to

personal injury, equipment damage, and environment

deterioration.

FusionServer XH321L V5 Liquid-Cooled Server Node

Technical White Paper About This Document

Change History

Issue Date Description

07 2023-11-30 ● Added 11 Waste Product Recycling.

06 2023-02-28 ● Updated 5.7.1 Mainboard .

● Added A.5 Sensor List.

05 2022-11-11 Updated 8.1 Security.

04 2022-08-12 ● Optimized 6.3 Physical Specifications .

● Added A.1 Node Label.

03 2022-06-25 ● Added a figure that shows how to measure

dimensions.

● Updated 5.4.1 Drive Configuration and

5.4.2 Drive Numbering.

● Added 5.4.3 Drive Indicators.

02 2022-03-18 Added Certifications [XH321L V5-BP].

01 2021-12-20 This issue is the first official release.

FusionServer XH321L V5 Liquid-Cooled Server Node

Technical White Paper About This Document

Contents

About This Document.........................................................................................................ii

1 Product Introduction....................................................................................................... 1

2 Features............................................................................................................................ 4

3 Physical Structure........................................................................................................... 7

4 Logical Structure........................................................................................................... 10

5 Hardware Description.................................................................................................... 11

5.1 Front Panel.................................................................................................................................................11

5.1.1 Appearance.............................................................................................................................................11

5.1.2 Indicators and Buttons............................................................................................................................ 12

5.1.3 Ports .......................................................................................................................................................14

5.1.4 Installation Positions............................................................................................................................... 16

5.2 Processor...................................................................................................................................................16

5.3 Memory......................................................................................................................................................17

5.3.1 DDR4 Memory........................................................................................................................................ 18

5.3.1.1 Memory Identifier................................................................................................................................. 18

5.3.1.2 Memory Subsystem Architecture.........................................................................................................19

5.3.1.3 Memory Compatibility.......................................................................................................................... 20

5.3.1.4 DIMM Installation Rules.......................................................................................................................21

5.3.1.5 Memory Installation Positions.............................................................................................................. 22

5.3.1.6 Memory Protection Technologies.........................................................................................................23

5.4 Storage...................................................................................................................................................... 23

5.4.1 Drive Configuration................................................................................................................................. 24

5.4.2 Drive Numbering.....................................................................................................................................25

5.4.3 Drive Indicators.......................................................................................................................................26

5.4.4 RAID Controller Card..............................................................................................................................26

5.5 Network......................................................................................................................................................26

5.5.1 LOMs ..................................................................................................................................................... 26

5.6 I/O Expansion............................................................................................................................................ 29

5.6.1 PCIe Cards............................................................................................................................................. 29

5.6.2 PCIe Slots...............................................................................................................................................29

5.6.3 PCIe Slot Description..............................................................................................................................29

FusionServer XH321L V5 Liquid-Cooled Server Node

Technical White Paper Contents

5.7 Boards........................................................................................................................................................30

5.7.1 Mainboard ..............................................................................................................................................30

6 Product Specifications.................................................................................................. 32

6.1 Technical Specifications.............................................................................................................................32

6.2 Environmental Specifications.....................................................................................................................36

6.3 Physical Specifications ............................................................................................................................. 38

7 Software and Hardware Compatibility......................................................................... 39

8 Safety Instructions.........................................................................................................40

8.1 Security......................................................................................................................................................40

8.2 Maintenance and Warranty........................................................................................................................43

9 System Management..................................................................................................... 44

10 Certifications................................................................................................................ 46

11 Waste Product Recycling............................................................................................ 47

A Appendix........................................................................................................................ 48

A.1 Node Label................................................................................................................................................ 48

A.2 Product SN................................................................................................................................................ 48

A.3 Operating Temperature Limitations........................................................................................................... 50

A.3.1 Operating Temperature Limitations (Supercapacitor for the RAID Controller Card Configured)............50

A.3.2 Operating Temperature Limitations (Optical Modules Configured).........................................................51

A.3.3 Operating Temperature Limitations (Avago SAS3004iMR RAID Controller Card + M.2 FRU Configured)

.........................................................................................................................................................................54

A.4 RAS Features............................................................................................................................................55

A.5 Sensor List.................................................................................................................................................57

B Glossary......................................................................................................................... 67

B.1 A-E.............................................................................................................................................................67

B.2 F-J............................................................................................................................................................. 67

B.3 K-O............................................................................................................................................................ 68

B.4 P-T.............................................................................................................................................................68

B.5 U-Z.............................................................................................................................................................69

C Acronyms and Abbreviations...................................................................................... 70

C.1 A-E............................................................................................................................................................ 70

C.2 F-J............................................................................................................................................................. 71

C.3 K-O............................................................................................................................................................73

C.4 P-T.............................................................................................................................................................73

C.5 U-Z............................................................................................................................................................ 75

FusionServer XH321L V5 Liquid-Cooled Server Node

Technical White Paper Contents

1 Product Introduction

The FusionServer XH321L V5 (XH321L V5) is a liquid-cooled server node designed

for X6000 servers. An X6000 can house up to four XH321L V5 server nodes in a 2U

chassis.

The XH321L V5 delivers supreme performance and high storage density in limited

space through innovative design. It supports liquid cooling and is easy to manage

and maintain.

The XH321L V5 supports six 2.5-inch SAS/SATA/NVMe drives, up to 16 DDR4

memory modules, and one PCIe standard card or screw-in RAID controller card.

The XH321L V5 is ideal for data center, cloud computing, Big Data, and Internet

applications.

The XH321L V5 nodes are available in two types of configurations: liquid cooling of

processors only and liquid cooling of processors and memory modules.

FusionServer XH321L V5 Liquid-Cooled Server Node

Technical White Paper 1 Product Introduction

Figure 1-1 XH321L V5 (liquid cooling of processors only)

Figure 1-2 XH321L V5 (liquid cooling of processors and memory modules)

FusionServer XH321L V5 Liquid-Cooled Server Node

Technical White Paper 1 Product Introduction

Table 1-1 Configuration description

Configuration Application description

Liquid cooling of

processors

● Liquid cold plates for processors are provided.

● It fits into our company's full liquid cooling cabinets or

customer's liquid-cooled cabinets.

● When used with our company's full liquid cooling

cabinets, the memory and other components are

cooled by the air/liquid heat exchanger in the cabinet.

Liquid cooling of

processors and

memory modules

● Liquid cold plates for processors and memory

modules are provided.

● It fits into our company's board-level liquid cooling

cabinets or customer's liquid-cooled cabinets.

FusionServer XH321L V5 Liquid-Cooled Server Node

Technical White Paper 1 Product Introduction

2 Features

Performance and Scalability

● Powered by two Intel® Xeon® Scalable Skylake or Cascade Lake processors,

the server provides up to 28 cores, 3.8 GHz frequency, a 38.5 MB L3 cache, and

two 10.4 GT/s UPI links between the processors, which deliver supreme

processing performance.

– It supports up to two processors with 56 cores and 112 threads to maximize

the concurrent execution of multithreaded applications.

– An L2 cache is added. Each core can exclusively use 1 MB of L2 cache and

at least 1.375 MB of L3 cache.

– Intel Turbo Boost Technology 2.0 allows processor cores to run faster than

the frequency specified in the Thermal Design Power (TDP) configuration if

they are operating below power, current, and temperature specification

limits.

– Intel Hyper-Threading Technology enables each processor core to run up to

two threads, improving parallel computation capability.

– The hardware-assisted Intel® Virtualization Technology (Intel® VT) allows

operating system (OS) vendors to better use hardware to address

virtualization workloads.

– Intel® Advanced Vector Extensions (Intel AVX 2.0 and Intel AVX-512)

significantly accelerate floating-point performance for computing-intensive

applications.

– The Cascade Lake processors support Intel® Deep Learning Boost vector

neural network instructions (VNNI) to improve the performance of deep

learning applications.

● The 1.2 V DDR4 memory modules consume 20% less power than 1.35 V

DDR3L memory modules used by the previous-generation platform.

● The server node supports double data rate 4 (DDR4) registered dual in-line

memory modules (RDIMMs) and load-reduced DIMMs (LRDIMMs) with error

checking and correcting (ECC). A server node fully configured with sixteen 2933

MT/s memory modules (only available with Cascade Lake processors) provides

1 TB memory space and the maximum theoretical memory bandwidth of 274.97

GB/s.

FusionServer XH321L V5 Liquid-Cooled Server Node

Technical White Paper 2 Features

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