Diamond Systems Jackson JAX-BB01 Manual de usuario
JACKSON
Carrier for NVIDIA
®
Orin Nano / NX
User Manual
Copyright 2023
Diamond Systems Corporation
www.diamondsystems.com
Revision Date Comment
1.01 22 Feb 2023 Initial version
FOR
TECHNICAL
SUPPORT
PLEASE
CONTACT:
Email: [email protected]
Table of Contents
1.IMPORTANT SAFE HANDLING INFORMATION....................................................................3
1.INTRODUCTION .......................................................................................................................5
1.1MODULE FEATURES ............................................................................................................................. 5
1.2I/O FEATURES &CONNECTORS ........................................................................................................... 6
1.3JACKSON ORDERING GUIDE (TBD) ..................................................................................................... 7
2.PRODUCT PHOTOS ................................................................................................................8
3.CONNECTOR AND JUMPER LOCATIONS ............................................................................9
4.BASE DIMENSION DRAWING ..............................................................................................10
5.FUNCTIONAL OVERVIEW.....................................................................................................12
5.1PROCESSOR MODULE ........................................................................................................................ 12
5.2POWER SUPPLY.................................................................................................................................. 12
5.3ETHERNET ......................................................................................................................................... 12
5.4DISPLAY ............................................................................................................................................ 12
5.5EXPANSION CONNECTOR.................................................................................................................... 12
5.6CAMERA ............................................................................................................................................ 13
5.7SERIAL PORTS.................................................................................................................................... 13
5.8PCIE LINK ROUTING.......................................................................................................................... 13
5.9M.2 SOCKET ...................................................................................................................................... 13
5.10MINICARD ......................................................................................................................................... 13
5.11USB .................................................................................................................................................. 13
5.12DIGITAL I/O....................................................................................................................................... 14
5.13CONTROLLER AREA NETWORK (CAN).............................................................................................. 14
5.14UTILITY ............................................................................................................................................. 14
5.15LED INDICATORS .............................................................................................................................. 14
6.JUMPER CONFIGURATIONS................................................................................................15
7.BLOCK DIAGRAM..................................................................................................................16
8.HEAT SINK .............................................................................................................................17
9.I/O CONNECTORS .................................................................................................................18
9.1POWER IN.......................................................................................................................................... 18
9.2RTC BATTERY................................................................................................................................... 18
9.3FAN ................................................................................................................................................... 18
9.4ETHERNET ......................................................................................................................................... 19
9.5HDMI................................................................................................................................................ 19
9.6CAMERA ............................................................................................................................................ 20
9.7SERIAL PORTS.................................................................................................................................... 21
9.8EXPANSION CONNECTOR.................................................................................................................... 22
9.9USB 3.0/2.0....................................................................................................................................... 22
9.10M.2 PCIE SSD SOCKET ..................................................................................................................... 24
9.11M.2 E-KEY ........................................................................................................................................ 25
9.12MINICARD ......................................................................................................................................... 26
9.13DIGITAL I/O....................................................................................................................................... 27
9.14CAN.................................................................................................................................................. 27
9.15UTILITY ............................................................................................................................................. 28
10.DESIGN AND LABELING GUIDELINES .................... ERROR! BOOKMARK NOT DEFINED.
10.1CONNECTOR LABELING ............................................................... ERROR!BOOKMARK NOT DEFINED.
10.2TEST POINTS................................................................................ ERROR!BOOKMARK NOT DEFINED.
10.3OPERATING TEMPERATURE ......................................................... ERROR!BOOKMARK NOT DEFINED.
10.4COMPONENT AVAILABILITY ........................................................ ERROR!BOOKMARK NOT DEFINED.
10.5LABELING.................................................................................... ERROR!BOOKMARK NOT DEFINED.
10.6ORIN NX B2B CONNECTOR INTERFACE ............................................................................................ 29
10.7ORIN NANO /NX MODULE BLOCK DIAGRAM ................................................................................... 31
1. IMPORTANT SAFE HANDLING INFORMATION
WARNING!
ESD-Sensitive Electronic Equipment
Observe ESD-safe handling procedures when working with this product.
Always use this product in a properly grounded work area and wear
appropriate ESD-preventive clothin
g
and/or accessories.
Always store this product in ESD-protective packaging when not in use.
Safe Handling Precautions
Diamond Systems boards are designed with complex circuitry and electronic components that are ESD-sensitive.
This increases the likelihood of the boards incurring accidental damage during handling, installation, and
connection to other equipment.
It is highly recommended that the following precautionary measures and best practices be observed in sequential
order:
Wear an anti-static Wristband/Strap or/and an antistatic Lab Coat or/and Rubber-soled shoes.
Spread anti-static mats over the table or work surface or/and anti-static mats on the floor.
Unpack components and remove them from their anti-static bags only when they are ready to be
used.
Avoid ungrounded surfaces such as plastic, carpets, floors, or tables, in the work area.
Handle boards by the edges and their metal mounting brackets. Avoid touching components on the
boards and the edge connectors that connect to expansion slots.
The following information describes common causes of failure found on boards and components returned to
Diamond Systems for repair. It is provided as a guideline to avoid accidental damage.
ESD Damage: This type of damage is typically impossible to detect because there is no visual sign of failure or
damage. In this type of damage, the board eventually stops functioning because of some defective components.
Usually, the failure can be identified, and the chip can be replaced. To prevent ESD damage, always follow proper
ESD-prevention practices when handling computer boards.
Damage During Handling or Storage: Physical damage on boards also occur due to mishandling. A common
observation is that of a screwdriver slipping on the board during installation, causing a gouge on the PCB surface,
cutting signal traces or damaging components.
Another common observation is damaged board corners, indicating the board was dropped. This may or may not
cause damage to the circuitry, depending on components located near the edges. Most Diamond System boards
are designed with a minimum 25 mils clearance between the board edge and component pad. The ground/power
planes are located a minimum of 20 mils from the edge to avoid possible shorting from this type of damage.
However, these design rules do not prevent damage in all situations.
Sometimes boards are stored in racks with slots that grip the edge of the board. This is a common practice for
board manufacturers. Though Diamond Systems boards are resilient to damages, the components located close
to the board edges can be damaged or even knocked off the board if the board lies tilted in the rack.
Diamond Systems recommends that all boards be stored only in individual ESD-safe packaging units. If multiple
boards are stored together, they should be contained in bins with dividers placed between the boards. Do not pile
boards on top of each other or cram too many boards within a small location. This can cause damage to connector
pins or fragile components.
Bent Connector Pins: This type of problem can be resolved by re-bending the pins to their original shape using needle-
nose pliers.
The most common cause of a bent connector pin is pulling a ribbon cable off a pin header in a manner not directly in
line with the mating direction. To remove a ribbon cable, rock the cable back and forth on an axis parallel to the length
of the connector until it can be easily pulled off. If the pins are bent too severely, bending them back can cause them
to weaken or break. In this case, the connector must be replaced.
Power Damage: There are various causes of power-specific damage that can occur while handling the board. Some
common causes such as –a metal screwdriver tip slipping, or a screw dropping onto the board while it is powered-
up, causes a short between a power pin and a signal pin on a component.
These faults can cause over-voltage/power supply problems besides other causes described below.
To avoid such damages, assembly operations must be performed when the system is powered off.
Power Supply Wired Backwards: Diamond Systems power supplies and boards are not designed to withstand a
reverse power supply connection. This will destroy almost all ICs connected to the power supply. In this case, the
board will likely be irreparable and must be replaced. A chip destroyed by reverse or excessive power will often have
a visible hole or show some deformation on the surface due to vaporization inside the package.
Overvoltage on Analog Input: If a voltage applied to an analog input exceeds the power specification of the board, the
input multiplexer and/or parts behind it can be damaged. Most Diamond Systems boards will withstand an erroneous
connection of up to 36V on the analog inputs, even when the board is powered off, but not on all boards, and not
under all conditions.
Overvoltage on Analog Output: If an Analog output is accidentally connected to another output signal or a power
supply voltage, the output can be damaged. On most Diamond boards, a short circuit to ground on an analog output
will deter any damage to the board.
Overvoltage on Digital I/O Line: If a Digital I/O signal is connected to a voltage above the maximum specified voltage,
the digital circuitry can be damaged. The acceptable voltage range on most Diamond Systems boards connected to
digital I/O signals is 0-5V, with overvoltage protection up to 5.5V (-0.5 to 5.5V). Overvoltage beyond this limit can
damage the circuitry.
IMPORTANT! Always check twice before Powering Up!
DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 5 of 31
1. INTRODUCTION
Jackson is an Nvidia Jetson Orin Nano / Orin NX module-based board with rich graphics and camera input capability. This base
board converts the module into a complete embedded system by providing interface circuitry, I/O connectors for all the major
features of the module, camera interface, power supply and additional I/O capabilities.
This Base Board redefines possibility; a combination of performance, power efficiency, integrated deep learning capabilities and
rich I/O remove the barriers to a new generation of low-cost products.
The base board also contains M.2 x4 lane PCIe SSD as storage options along with interfaces like HDMI, USB3.2, CAN, Serial
ports, Utility connector etc.
1.1 Module features
Features Jetson Orin Nano 4GB/8GB
AI Performance 20 TOPS (Sparse) |10 TOPS (Dense) / 40 TOPS (Sparse) |20 TOPS (Dense)
GPU 512 core NVIDIA Ampere GPU with 16 Tensor Cores /
1024 core NVIDIA Ampere GPU with 32 Tensor Cores
CPU 6core NVIDIA Arm® Cortex A78AE v8.2 64-bit CPU, 1.5 GHz 1.5MB L2 + 4MB L3
VIDEO 1x 8K @ 30 Encode (HEVC)
1x 4K @ 60 Decode (HEVC)
MEMORY 4GB 64bit LPDDR5 @2133 MHZ, 34 GB/s /
8GB 128bit LPDDR5 @2133 MHZ, 68 GB/s
CAMERA 8 lanes (2x4 or 4x2) MIPI CSI-2 D-PHY 1.2 (2.5 Gb/s per pair)
CONNECTIVITY 1 Gigabit Ethernet, 3 x1 + 1 x4 PCIe lanes
DISPLAY HDMI 2.1 and eDP 1.4
USB 3x USB 3.2, 3x USB 2.0
OTHERS GPIO, I2C, I2S, SPI, UART
POWER 5W to 10W / 7W to 15W
Features Jetson Orin N
X
8GB/16GB
AI Performance 70 INT8 Sparse TOPs /100 INT8 Sparse TOPS
GPU 1024 core NVIDIA Ampere GPU with 32 Tensor Cores
CPU 6-core NVIDIA A78 CPU /8-core NVIDIA A78 CPU
VIDEO 1x 8K @ 30 Encode (HEVC)
1x 4K @ 60 Decode (HEVC)
MEMORY 8GB 128bit LPDDR5 @2133 MHZ, 102GB/s /
16 GB 128-bit LPDDR5, 3200MHz 102GB/s
CAMERA 8 lanes (2x4 or 4x2) MIPI CSI-2 D-PHY 1.2 (2.5 Gb/s per pair)
CONNECTIVITY 1 Gigabit Ethernet, 3 x1 + 1 x4 PCIe lanes
DISPLAY HDMI 2.1 and eDP 1.4
USB 3x USB 3.2, 3x USB 2.0
OTHERS GPIO, I2C, I2S, SPI, UART
POWER 10W to 20W / 10W to 25W
DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 6 of 31
1.2 I/O Features & Connectors
Feature Description Connector Type
Power 7V - 20V wide input supply DC barrel jack (J3) or
Terminal Block (J2)
RTC 1.85V – 5.5V power input for RTC functionality 1x2 connector (J16)
Ethernet
1x 10/100/1000Mbps from the Orin NX module
1x Dual port RJ45 (J5)
1x 10/100/1000Mbps from the I210 controller
(Not supported when expansion card is used)
Mass Storage 1x M.2 PCIe SSD socket M.2 2280/2242 (J20)
1x M.2 E key M.2 2230 (J17)
Minicard Minicard expansion with x1 PCIe and x1 USB2.0 with
SIM connector Mini Card Connector (J18)
USB
2x USB 3.2 / USB 2.0 1x USB3 Dual port RA (J4)
1x USB2.0 1x4 Header (J21)
1x USB3.2 / USB2.0
(Not supported when expansion card is used)
2x5 Header (J12)
Serial Ports
1x RS-232/485 port via jumper configuration 1 x DB9 Connector (J1)
1x RS232
1xRS232/RS485 (Shared with DB9 port) 2x5 Header (J7)
Display 1x HDMI 2.1 a/b directly from the module with audio 1x Upright HDMI connector
(J6)
Camera 2x4 lane CSI-2 Camera Interface 2x 22-pin FPC cable
connector (J22 & J23)
Digital IOs 16x Digital IOs 3.3V/5V realized using I2C GPIO
expander 2x10 Header (J10)
Expansion
Connector
1x USB3.2, 1x USB2.0 and PCIe x1 lane
FPC 40-Pin 0.5mm Pitch
(J9)
CAN 1x CAN interface 1x4 SMD connector (J14)
Fan Active Thermal Solution with PWM & Tach Input 1x4 SMD connector (J15)
Utility Power Button, Reset, Force Recovery Force OFF,
I2C(3.3V), SPI(3.3V), Debug UART 2x10 Header (J13)
Operating System Support
Linux Kernel version 4.9
Mechanical, Electrical and Environmental Properties
Form-Factor 85mm x 110mm
Cooling Mechanism Conduction Cooling
Power Input Range 7V – 20V; 12V Typical
Operating Temperature
Range
-25°C to +80°C at Thermal Transfer Plate (TTP) surface of
Orin Module
DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 7 of 31
1.3 Jackson Ordering Guide
The table below lists the current and planned part numbers.
JAX-BB01 Jackson carrier board for Nvidia Jetson Orin Nano and Orin NX
JAX-ASY-ONA8 Jackson carrier board with Orin Nano 8GB module installed and
programmed, with fan sink
JAX-ASY-ONX8 Jackson carrier board with Orin NX 8GB module installed and
programmed, with fan sink
JAX-ASY-ONX16 Jackson carrier board with Orin NX 16GB module installed and
programmed, with fan sink
DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 8 of 31
2. PRODUCT PHOTOS
Figure 2-1: Orin Nano / NX module installation side
Figure 2-2: IO Expansion Side
DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 9 of 31
3. CONNECTOR AND JUMPER LOCATIONS
J14
CAN
J12
USB3.0
J16
BAT
J9
Expansion
J8
CAMPower
J2/J3
PowerIN
J6
HDMI
J4
2xUSB3.0/2.0
J5
2xEthernet
J1
1xRS232/RS485
J7
1xRS232
J10
16xDIO
J13
Utility
J15
1xFAN SW3
Zeroize
JP1
JP2
Figure 3-1: Orin Nano / NX module installation side
J23
CAM‐2
J22
CAM‐1
J21
USB2.0
SW1ForceRecovery SW2Reset
J20
M.2Mkey
(2242/2280
)
J18
Minicard
J17
M.2Ekey
(2230)
Figure 3-2: IO Expansion Side
DIAMOND SYSTEMS CONFIDENTIAL Jackson User Manual Page 10 of 31
4. BASE DIMENSION DRAWING
Below figures represent the board dimension drawing.
Figure 4-1: Dimension Drawing of module installation side
Este manual sirve para los siguientes modelos
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