Dell AW2521HF Manual

DELL AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA

1. Disassembly Procedures

Note: The disassembly procedure for AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA is the

same. The differe ce is o ly the appeara ce color. The actual color of AW2521HF/ AW2521HFA

is black, but AW2518HFL/ AW2521HFLA is Lu ar Light.

Tur off the mo itor.

Place the mo itor o a soft cloth or

cushio .

Carefully slide a d remove the I/O cover

from the mo itor

Disco ect the cables from the mo itor

a d slide them out through the

cable-ma ageme t slot o the sta d

riser.

Press a d hold the sta d release

butto .

Lift the sta d up a d away from the

mo itor

U lock 4 screws o Rear Cover

Use ha ds or scraper bar to

disassemble Rear Cover from mo itor

Notice the disassembly order:

Top Side=>Right/ Left Side=>Bottom Side

(Screw Torque: 8~10kgf)

Remove USB FFC Cable a d Audio

FFC cable from the I/F BD

ELL

AW2521HF

/ AW2521HFL

/ AW2521HFA/ AW2521HFLA

Remove CTRL FFC Cable from I/F BD

Tear off a adhesive tape a d remove

the LED Driver BD wire from I/F BD

Tear off all adhesive tapes from Rear

Cover

S10

U lock 2 USB screws to disassemble

USB BD from Rear Cover

(Screw Torque: 4.5±0.5Kg kgf)

S11

Disassemble “USB FFC cable” a d

“Audio FFC cable” from USB BD

S12

U plug wires from LED Driver BD

U lock 1 screw to disassemble LED

Driver BD from Rear Cover

Tear off “MYLAR HEAD LOGO from

LED Logo Le s

U plug wire from LED BD a d

disassemble LED BD from Rear Cover

(Screw Torque: 3.0-3.5kgf)

DELL AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA

S13

Remove FFC cables from Rear Cover,

CTRL BD a d CTRL+KEY BD

U lock 6 screws to disassemble CTRL

BD a d CTRL+KEY BD from Rear

Cover

(Screw Torque: 2.0±0.5kgf)

S14

Tear off mylar a d all tapes from

Backlight Wire o Mai SHD

U plug Backlight Wire from SPS BD

S15

U plug “Power LENS FFC cable” from

I/F BD a d tear off “Power LENS FFC

cable” from the pa el

U plug EDP FFC Cable betwee pa el

a d I/F BD

S16

U lock 15 screws to disassemble

Middle Frame from Pa el

(Screw Torque: 4.0±0.5kgf)

Take off Mai SHD from Pa el a d

disassemble Middle Frame from Pa el

ELL

AW2521HF

/ AW2521HFL

/ AW2521HFA/ AW2521HFLA

S18

Tear off a tape o backlight wire a d

u plug backlight wire from pa el

S19

U lock 2 screws to disassemble Power

Butto module from middle frame

(Screw Torque: 2.0±0.5kgf)

S20

U plug Power LENS FFC cable from

“LENS BD” (Power LENS BD)

S21

Disassemble “MYLAR CTRL-BD” from

“LENS BD” (Power LENS BD)

S22

U lock 2 screws to disassemble “LENS

BD” (Power CTRL BD) from Power

Butto

(Screw Torque: 2.0±0.5kgf)

S23

U lock 1 screw o Docki g BD

(Screw Torque: 8.5±1.0 kgf)

S24

Disassemble “I/F BD to Docki g BD

wire” from Docki g BD

S25

Take off “MYLAR PWR-BD” from Mai

SHD

S26

Tear off the adhesive tape o “FFC

EDP” a d u plug “FFC EDP “ from I/F

BD, the , U lock 8 PCBA screws

(Screw Torque: 8.5±1.0kgf)

Disassemble I/F BD from Mai SHD

DELL AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA

S28

Disassemble wires from I/F BD

S29

Disassemble SPS BD from Mai SHD

a d disassemble “AC Socket Wire” from

SPS BD

S30

U lock 1 grou d screw a d

disassemble AC power socket from

Mai SHD

(Screw Torque: 8.5±1.0 kgf)

ELL

AW2521HF

/ AW2521HFL

/ AW2521HFA/ AW2521HFLA

S31

Remove electrolyte capacitors (red mark) from pri ted circuit boards

S31-1 Cut the glue betwee bulk cap. a d PCB with a k ife

S31-2 E sure cutti g path withi the glue, do ’t touch bulk cap. or PCB

DELL AW2521HF/ AW2521HFL/ AW2521HFA/ AW2521HFLA

S31-3 Take out bulk cap. pi solder with solderi g iro a d absorber

S31-4 Lift the bulk cap. up a d away from the PCB

ELL

AW2521HF

/ AW2521HFL

/ AW2521HFA/ AW2521HFLA

2. Product material information

The following substances, preparations, or components should be disposed of or

recovered separately from other WEEE in compliance with Article 4 of EU Council

Directive 75/442/EEC.

Capacitors / condensers (containing

PCB/PCT)

No used

Mercury containing components

No used

Batteries No used

Printed circuit boards (with a surface greater

than 10 square cm)

Product has printed circuit boards

(with a surface greater than 10 square

cm)

Component contain toner, ink and liquids No used

Plastic containing BFR

No used

Component and waste contain asbestos

No used

CRT No used

Component contain CFC, HCFC, HFC and

No used

Gas discharge lamps

No used

LCD display > 100 cm2 Product has an LCD greater than 100

cm2

External electric cable Product has external cables

Component contain refractory ceramic fibers

No used

Component contain radio

active substances

No used

Electrolyte capacitors (height

> 25mm, diameter > 25mm)

Product has electrolyte capacitors

(height >25mm, diameter > 25mm)

3. Tools Required

List the type and size of the tools that would typically can be used to disassemble the

product to a point where components and materials requiring selective treatment can be

removed.

Tool Description:

- Screwdriver

- Scraper Bar

- Penknife

- Soldering iron and absorber

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